Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XCS30XL-4PQ208CXCS30XL-4PQ208CAdvanced Micro DevicesIC FPGA 169 I/O 208QFPFPGAs208-PQFP (28x28)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
169
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,015
XCS30XL-4PQ208IXCS30XL-4PQ208IAdvanced Micro DevicesIC FPGA 169 I/O 208QFPFPGAs208-PQFP (28x28)3 V - 3.6 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
30000
Number of I/O:
169
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Qualification:
N/A
Total RAM Bits:
18432
832
N/AXCS30XL-4PQ240CAdvanced Micro DevicesIC FPGA 192 I/O 240QFPFPGAs240-PQFP (32x32)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
192
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
48
XCS30XL-4PQG208CXCS30XL-4PQG208CAdvanced Micro DevicesIC FPGA 169 I/O 208QFPFPGAs208-PQFP (28x28)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
169
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Qualification:
N/A
Total RAM Bits:
18432
1,073
XCS30XL-4TQ144CXCS30XL-4TQ144CAdvanced Micro DevicesIC FPGA 113 I/O 144TQFPFPGAs144-TQFP (20x20)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
113
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
155
XCS30XL-4TQ144IXCS30XL-4TQ144IAdvanced Micro DevicesIC FPGA 113 I/O 144TQFPFPGAs144-TQFP (20x20)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
113
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,312
XCS30XL-4TQG144CXCS30XL-4TQG144CAdvanced Micro DevicesIC FPGA 113 I/O 144TQFPFPGAs144-TQFP (20x20)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
113
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Qualification:
N/A
Total RAM Bits:
18432
863
XCS30XL-4TQG144IXCS30XL-4TQG144IAdvanced Micro DevicesIC FPGA 113 I/O 144TQFPFPGAs144-TQFP (20x20)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
113
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,627
XCS30XL-4VQ100CXCS30XL-4VQ100CAdvanced Micro DevicesIC FPGA 77 I/O 100VQFPFPGAs100-VQFP (14x14)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
77
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Qualification:
N/A
Total RAM Bits:
18432
1,380
XCS30XL-4VQ100IXCS30XL-4VQ100IAdvanced Micro DevicesIC FPGA 77 I/O 100VQFPFPGAs100-VQFP (14x14)3V ~ 3.6V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
77
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
100-TQFP
Supplier Device Package:
100-VQFP (14×14)
134
XCS30XL-4VQG100CXCS30XL-4VQG100CAdvanced Micro DevicesIC FPGA 77 I/O 100VQFPFPGAs100-VQFP (14x14)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
77
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Qualification:
N/A
Total RAM Bits:
18432
884
XCS30XL-5BG256CXCS30XL-5BG256CAdvanced Micro DevicesIC FPGA 192 I/O 256BGAFPGAs256-PBGA (27x27)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
192
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Qualification:
N/A
Total RAM Bits:
18432
806
XCS30XL-5CS280CXCS30XL-5CS280CAdvanced Micro DevicesIC FPGA 192 I/O 280CSBGAFPGAs280-CSBGA (16x16)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
192
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
280-TFBGA, CSPBGA
Supplier Device Package:
280-CSBGA (16×16)
149
XCS30XL-5PQ208CXCS30XL-5PQ208CAdvanced Micro DevicesIC FPGA 169 I/O 208QFPFPGAs208-PQFP (28x28)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
169
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
138
N/AXCS30XL-5PQ240CAdvanced Micro DevicesIC FPGA 192 I/O 240QFPFPGAs240-PQFP (32x32)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
192
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
99
XCS30XL-5TQ144CXCS30XL-5TQ144CAdvanced Micro DevicesIC FPGA 113 I/O 144TQFPFPGAs144-TQFP (20x20)3 V - 3.6 V0°C – 85°C
Grade:
Commercial
Number of Gates:
30000
Number of I/O:
113
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Qualification:
N/A
Total RAM Bits:
18432
1,905
XCS30XL-5VQ100CXCS30XL-5VQ100CAdvanced Micro DevicesIC FPGA 77 I/O 100VQFPFPGAs100-VQFP (14x14)3V ~ 3.6V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
576
Number of Logic Elements/Cells:
1368
Total RAM Bits:
18432
Number of I/O:
77
Number of Gates:
30000
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
100-TQFP
Supplier Device Package:
100-VQFP (14×14)
1,566
XCS40-3BG256CXCS40-3BG256CAdvanced Micro DevicesIC FPGA 205 I/O 256BGAFPGAs256-PBGA (27x27)4.75V ~ 5.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
784
Number of Logic Elements/Cells:
1862
Total RAM Bits:
25088
Number of I/O:
205
Number of Gates:
40000
Voltage – Supply:
4.75V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (27×27)
774
XCS40-3PQ208CXCS40-3PQ208CAdvanced Micro DevicesIC FPGA 169 I/O 208QFPFPGAs208-PQFP (28x28)4.75V ~ 5.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
784
Number of Logic Elements/Cells:
1862
Total RAM Bits:
25088
Number of I/O:
169
Number of Gates:
40000
Voltage – Supply:
4.75V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
189
XCS40-3PQ208IXCS40-3PQ208IAdvanced Micro DevicesIC FPGA 169 I/O 208QFPFPGAs208-PQFP (28x28)4.5V ~ 5.5V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
784
Number of Logic Elements/Cells:
1862
Total RAM Bits:
25088
Number of I/O:
169
Number of Gates:
40000
Voltage – Supply:
4.5V ~ 5.5V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
465

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