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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | N/A | MCE360CZQ25LR2 | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | 5.0V | -40°C – 85°C | Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Mounting Type: Surface Mount | 967 | |
 | MCF5206AB25A | NXP Semiconductors | IC MPU MCF520X 25MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz RAM Controllers: DRAM Voltage – I/O: 5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 391 | ||
 | MCF5206AB33A | NXP Semiconductors | IC MPU MCF520X 33MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz RAM Controllers: DRAM Voltage – I/O: 5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 1,140 | ||
 | MCF5206EAB40 | NXP Semiconductors | IC MPU MCF520X 40MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 40MHz RAM Controllers: DRAM Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 528 | ||
 | MCF5206EAB54 | NXP Semiconductors | IC MPU MCF520X 54MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 54MHz RAM Controllers: DRAM Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 1,250 | ||
 | MCF5206ECAB40 | NXP Semiconductors | IC MPU MCF520X 40MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 40MHz RAM Controllers: DRAM Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 626 | ||
 | MCF5206ECFT40 | NXP Semiconductors | IC MPU MCF520X 40MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 40MHz RAM Controllers: DRAM Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 1,288 | ||
 | MCF5206EFT40 | NXP Semiconductors | IC MPU MCF520X 40MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 40MHz RAM Controllers: DRAM Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 1,304 | ||
 | MCF5206EFT54 | NXP Semiconductors | IC MPU MCF520X 54MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 54MHz RAM Controllers: DRAM Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 5 | ||
 | MCF5206FT16A | NXP Semiconductors | IC MPU MCF520X 16MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 16MHz RAM Controllers: DRAM Voltage – I/O: 5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 741 | ||
 | MCF5206FT33A | NXP Semiconductors | IC MPU MCF520X 33MHZ 160QFP | Microprocessors | 160-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz RAM Controllers: DRAM Voltage – I/O: 5V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28×28) Additional Interfaces: EBI/EMI, I2C, UART/USART | 989 | ||
 | MCF5233CVM100 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microprocessors | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Speed: 100MHz Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 61 Program Memory Type: ROMless RAM Size: 64K x 8 Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) Package / Case: 256-LBGA | 695 | ||
 | MCIMX233CAG4B | NXP Semiconductors | IC MPU I.MX23 454MHZ 128LQFP | Microprocessors | 128-LQFP (14x14) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -40°C – 85°C | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Mounting Type: Surface Mount | 588 | ||
 | MCIMX233CAG4C | NXP Semiconductors | IC MPU I.MX23 454MHZ 128LQFP | Microprocessors | 128-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen USB: USB 2.0 + PHY (1) Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Package / Case: 128-LQFP Supplier Device Package: 128-LQFP (14×14) Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 1,271 | ||
 | MCIMX233CJM4C | NXP Semiconductors | IC MPU I.MX23 454MHZ 169MAPBGA | Microprocessors | 169-MAPBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen USB: USB 2.0 + PHY (1) Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (11×11) Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 796 | ||
 | MCIMX233CJM4CR2 | NXP Semiconductors | IC MPU I.MX23 454MHZ 169MAPBGA | Microprocessors | 169-MAPBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen USB: USB 2.0 + PHY (1) Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (11×11) Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 1,287 | ||
 | MCIMX233DAG4B | NXP Semiconductors | IC MPU I.MX23 454MHZ 128LQFP | Microprocessors | 128-LQFP (14x14) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -10°C – 70°C | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Mounting Type: Surface Mount | 257 | ||
 | MCIMX233DAG4C | NXP Semiconductors | IC MPU I.MX23 454MHZ 128LQFP | Microprocessors | 128-LQFP (14x14) | N/A | -10°C ~ 70°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen USB: USB 2.0 + PHY (1) Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -10°C ~ 70°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Package / Case: 128-LQFP Supplier Device Package: 128-LQFP (14×14) Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 579 | ||
 | MCIMX233DJM4B | NXP Semiconductors | IC MPU I.MX23 454MHZ 169MAPBGA | Microprocessors | 169-MAPBGA (11x11) | N/A | -10°C ~ 70°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen USB: USB 2.0 + PHY (1) Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -10°C ~ 70°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (11×11) Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 1,105 | ||
 | MCIMX233DJM4BR2 | NXP Semiconductors | IC MPU I.MX23 454MHZ 169MAPBGA | Microprocessors | 169-MAPBGA (11x11) | N/A | -10°C ~ 70°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen USB: USB 2.0 + PHY (1) Voltage – I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -10°C ~ 70°C (TA) Security Features: Cryptography, Hardware ID Mounting Type: Surface Mount Package / Case: 169-LFBGA Supplier Device Package: 169-MAPBGA (11×11) Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 444 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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