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Microprocessors

Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.

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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MPC7410HX450LE
MPC7410HX450LENXP SemiconductorsIC MPU MPC74XX 450MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,351
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MPC7410HX500LE
MPC7410HX500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
589
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MPC7410RX500LE
MPC7410RX500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
605
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MPC7410THX400LE
MPC7410THX400LENXP SemiconductorsIC MPU MPC74XX 400MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
140
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MPC7410THX450NEN/AMPC7410THX450NENXP SemiconductorsIC MPU MPC74XX 450MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,081
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MPC7410THX500LE
MPC7410THX500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
185
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MPC7410VS500LE
MPC7410VS500LENXP SemiconductorsIC MPU MPC74XX 500MHZ 360FCCLGAMicroprocessors360-FCCLGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-CLGA, FCCLGA
Supplier Device Package:
360-FCCLGA (25×25)
1,011
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N/A
MPC745BPX300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Mounting Type:
Surface Mount
1,284
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N/A
MPC745BPX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
255-BBGA, FCBGA
Supplier Device Package:
255-FCPBGA (21×21)
115
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N/A
MPC745BVT300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Mounting Type:
Surface Mount
201
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N/A
MPC745CPX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
396
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N/A
MPC745CVT350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 255FCPBGAMicroprocessors255-FCPBGA (21x21)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
1,516
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MPC755BPX300LE
MPC755BPX300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA, FCBGA
Supplier Device Package:
360-FCPBGA (25×25)
5
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MPC755BPX350LE
MPC755BPX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA, FCBGA
Supplier Device Package:
360-FCPBGA (25×25)
285
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MPC755BRX300LE
MPC755BRX300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
798
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MPC755BRX350LE
MPC755BRX350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 360CBGAMicroprocessors360-CBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-CBGA (25×25)
1,005
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MPC755BRX350TE
MPC755BRX350TENXP SemiconductorsIC MPU MPC7XX 350MHZ 360CBGAMicroprocessors360-CBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
730
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MPC755BVT300LE
MPC755BVT300LENXP SemiconductorsIC MPU MPC7XX 300MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Mounting Type:
Surface Mount
1,062
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MPC755BVT350LE
MPC755BVT350LENXP SemiconductorsIC MPU MPC7XX 350MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Mounting Type:
Surface Mount
361
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MPC755CPX400LER2
MPC755CPX400LER2NXP SemiconductorsIC MPU MPC7XX 400MHZ 360FCPBGAMicroprocessors360-FCPBGA (25x25)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
925
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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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