Microprocessors

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Total Products: 5,357
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMIMX9301CVVXDABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 105 °C
Speed:
900 MHz
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
RAM Controllers:
LPDDR4, LPDDR4X
Graphics Acceleration:
Yes
Display & Interface Controllers:
24-bit Parallel, 4-Lane LVDS, MIPI-DSI-4
Qualification:
Industrial
57
N/AMIMX9302CVVXDABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 105 °C
Speed:
900 MHz
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4, LPDDR4X
Graphics Acceleration:
Yes
Display & Interface Controllers:
24-bit Parallel, 4-Lane LVDS, MIPI-DSI-4
Qualification:
Industrial
1,068
N/AN/AMIMX9311CVXXMABNXP SemiconductorsICMicroprocessorsN/AN/A-40 °C – 105 °C
Speed:
1.7 GHz
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
RAM Controllers:
LPDDR4, LPDDR4X
Graphics Acceleration:
Yes
Display & Interface Controllers:
24-bit Parallel
Qualification:
Industrial
1,495
N/AMIMX9331AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
960
N/AMIMX9331CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
522
N/AMIMX9331CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
766
N/AMIMX9331XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
176
N/AMIMX9332AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
1,643
N/AMIMX9332CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
546
N/AMIMX9332CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
1,030
N/AMIMX9332XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
354
N/AMIMX9351AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
71
N/AMIMX9351CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
895
N/AMIMX9351CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
1,306
N/AMIMX9351XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
453
N/AMIMX9352AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
745
N/AMIMX9352CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
338
N/AMIMX9352CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
898
N/AMIMX9352XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
1,753
N/AMIMXRT1181CVP2BNXP SemiconductorsICMicroprocessors144-MAPBGA (10x10)N/A-40 °C – 105 °C
Speed:
300 MHz
Core Processor:
ARM® Cortex®-M33
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
LPDDR4
Ethernet:
1Gbps (3)
Graphics Acceleration:
No
Qualification:
Industrial
277

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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