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Microprocessors

Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.

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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/AN/AMIMX8QX1FVOFZACNXP SemiconductorsI.MX 8QUADXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
962
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N/AN/AMIMX8QX2AVOFZACNXP SemiconductorsI.MX8 QXP 17X17Microprocessors-N/A–

N/A

1,067
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QUOTE
N/AN/AMIMX8QX2FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
567
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QUOTE
N/AN/AMIMX8QX2FVOFZACNXP SemiconductorsI.MX 8QUADXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
232
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QUOTE
MIMX8QX5CVLFZACN/AMIMX8QX5CVLFZACNXP SemiconductorsMIMX8QX5CVLFZACMicroprocessorsN/AN/AN/A

N/A

1,786
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QUOTE
N/AN/AMIMX8QX5FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
352
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QUOTE
N/AN/AMIMX8QX5GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
798
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QUOTE
MIMX8QX6AVLFZAC
MIMX8QX6AVLFZACNXP SemiconductorsIC MPU 609FBGAMicroprocessors609-FBGA (21x21)N/A–
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
43
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QUOTE
MIMX8QX6CVLFZACN/AMIMX8QX6CVLFZACNXP SemiconductorsMIMX8QX6CVLFZACMicroprocessorsN/AN/AN/A

N/A

1,609
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QUOTE
N/AN/AMIMX8QX6FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
455
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QUOTE
N/AN/AMIMX8QX6GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
990
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QUOTE
N/AN/AMIMX8SL1AVNFZABNXP SemiconductorsI.MX8 DXL 15SQMicroprocessors388-LBGA (15x15)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
1Gbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
388-LFBGA
Supplier Device Package:
388-LBGA (15×15)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
1,243
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QUOTE
N/AN/AMIMX8SL1CVNFZABNXP SemiconductorsI.MX 8DUALXLITE 15SQMicroprocessors388-LBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
1Gbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
388-LFBGA
Supplier Device Package:
388-LBGA (15×15)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
219
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QUOTE
N/AN/AMIMX8SL1CVNFZBANXP SemiconductorsI.MX8SOLOLXLITE 15SQMicroprocessorsN/AN/AN/A

N/A

411
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QUOTE
N/A
MIMX8UD3CVP08SCNXP Semiconductors8ULP DUAL CORTEX A35MicroprocessorsN/AN/AN/A

N/A

32
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QUOTE
N/A
MIMX8UD3DVP08SCNXP SemiconductorsI.MX8ULP, DUAL 800MHZMicroprocessorsN/AN/AN/A

N/A

304
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QUOTE
N/A
MIMX8UD5CVP08SCNXP Semiconductors8ULP DUAL CORTEX A35MicroprocessorsN/AN/AN/A

N/A

700
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QUOTE
N/AN/AMIMX8UD5DVK08SCNXP SemiconductorsI.MX8ULP,DUAL 800MHZMicroprocessors-N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
800MHz
Co-Processors/DSP:
3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers:
LPDDR3, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
788
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QUOTE
N/A
MIMX8UD5DVP08SCNXP SemiconductorsI.MX8ULP,DUAL 800MHZMicroprocessors-N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
800MHz
Co-Processors/DSP:
3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers:
LPDDR3, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
619
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QUOTE
N/A
MIMX8UD7CVP08SCNXP SemiconductorsI.MX8ULP, DUAL 800MHZMicroprocessorsN/AN/AN/A

N/A

1,823
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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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