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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | N/A | MIMX8QX1FVOFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 17X17 | Microprocessors | 417-FBGA (17x17) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Package / Case: 417-BFBGA Supplier Device Package: 417-FBGA (17×17) | 1,477 | |
| N/A | N/A | MIMX8QX2AVOFZAC | NXP Semiconductors | I.MX8 QXP 17X17 | Microprocessors | - | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 63 | |
| N/A | N/A | MIMX8QX2FVLFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 1,220 | |
| N/A | N/A | MIMX8QX2FVOFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 17X17 | Microprocessors | 417-FBGA (17x17) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Package / Case: 417-BFBGA Supplier Device Package: 417-FBGA (17×17) | 908 | |
 | N/A | MIMX8QX5CVLFZAC | NXP Semiconductors | MIMX8QX5CVLFZAC | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 985 | |
| N/A | N/A | MIMX8QX5FVLFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 1,295 | |
| N/A | N/A | MIMX8QX5GVLFZAC | NXP Semiconductors | I.MX 8X FIPS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 1,947 | |
 | MIMX8QX6AVLFZAC | NXP Semiconductors | IC MPU 609FBGA | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Qualification: Automotive | 265 | ||
 | N/A | MIMX8QX6CVLFZAC | NXP Semiconductors | MIMX8QX6CVLFZAC | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 243 | |
| N/A | N/A | MIMX8QX6FVLFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 1,250 | |
| N/A | N/A | MIMX8QX6GVLFZAC | NXP Semiconductors | I.MX 8X FIPS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 384 | |
| N/A | N/A | MIMX8SL1AVNFZAB | NXP Semiconductors | I.MX8 DXL 15SQ | Microprocessors | 388-LBGA (15x15) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 1Gbps (2) USB: USB 2.0 + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Mounting Type: Surface Mount Package / Case: 388-LFBGA Supplier Device Package: 388-LBGA (15×15) | 708 | |
| N/A | N/A | MIMX8SL1CVNFZAB | NXP Semiconductors | I.MX 8DUALXLITE 15SQ | Microprocessors | 388-LBGA (15x15) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 1Gbps (2) USB: USB 2.0 + PHY (2) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG Mounting Type: Surface Mount Package / Case: 388-LFBGA Supplier Device Package: 388-LBGA (15×15) | 449 | |
| N/A | N/A | MIMX8SL1CVNFZBA | NXP Semiconductors | I.MX8SOLOLXLITE 15SQ | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 1Gbps (2) USB: USB 2.0 + PHY (2) Graphics Acceleration: No Co-Processors/DSP: ARM® Cortex®-M4F Display & Interface Controllers: LCD | 47 | |
| N/A | MIMX8UD3CVP08SC | NXP Semiconductors | 8ULP DUAL CORTEX A35 | Microprocessors | N/A | N/A | -40 °C – 105 °C | Speed: 800 MHz Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: LPDDR3, LPDDR4 Ethernet: 10/100Mbps USB: USB 2.0 (2) Graphics Acceleration: Yes Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP Display & Interface Controllers: MIPI-CSI, MIPI-DSI Qualification: Industrial | 1,730 | ||
| N/A | MIMX8UD3DVP08SC | NXP Semiconductors | I.MX8ULP, DUAL 800MHZ | Microprocessors | N/A | N/A | 0 °C – 95 °C | Speed: 800 MHz Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: LPDDR3, LPDDR4 Ethernet: 10/100Mbps USB: USB 2.0 (2) Graphics Acceleration: Yes Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP Display & Interface Controllers: MIPI-CSI, MIPI-DSI Qualification: Consumer | 1,088 | ||
| N/A | MIMX8UD5CVP08SC | NXP Semiconductors | 8ULP DUAL CORTEX A35 | Microprocessors | N/A | N/A | -40 °C – 105 °C | Speed: 800 MHz Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: LPDDR3, LPDDR4 Ethernet: 10/100Mbps USB: USB 2.0 (2) Graphics Acceleration: Yes Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP Display & Interface Controllers: MIPI-CSI, MIPI-DSI Qualification: Industrial | 1,304 | ||
| N/A | N/A | MIMX8UD5DVK08SC | NXP Semiconductors | I.MX8ULP,DUAL 800MHZ | Microprocessors | - | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 800MHz Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP RAM Controllers: LPDDR3, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI Ethernet: 10/100Mbps USB: USB 2.0 (2) Operating Temperature: 0°C ~ 95°C (TJ) | 320 | |
| N/A | MIMX8UD5DVP08SC | NXP Semiconductors | I.MX8ULP,DUAL 800MHZ | Microprocessors | - | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 800MHz Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP RAM Controllers: LPDDR3, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI Ethernet: 10/100Mbps USB: USB 2.0 (2) Operating Temperature: 0°C ~ 95°C (TJ) | 76 | ||
| N/A | MIMX8UD7CVP08SC | NXP Semiconductors | I.MX8ULP, DUAL 800MHZ | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: LPDDR3, LPDDR4 Ethernet: 10/100Mbps USB: USB 2.0 (2) Graphics Acceleration: Yes Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP Display & Interface Controllers: MIPI-CSI, MIPI-DSI | 1,201 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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