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Microprocessors

Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.

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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MIMX8MQ5CVAHZAA
MIMX8MQ5CVAHZAANXP SemiconductorsIC MPU I.MX8MQ 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
162
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MIMX8MQ5CVAHZAB
MIMX8MQ5CVAHZABNXP SemiconductorsIC MPU I.MX8MQ 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
564
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MIMX8MQ5DVAJZAA
MIMX8MQ5DVAJZAANXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
388
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MIMX8MQ5DVAJZAB
MIMX8MQ5DVAJZABNXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
842
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QUOTE
MIMX8MQ6CVAHZAB
MIMX8MQ6CVAHZABNXP SemiconductorsIC MPU I.MX8MQ 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
574
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QUOTE
MIMX8MQ6DVAJZAA
MIMX8MQ6DVAJZAANXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
1,233
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QUOTE
MIMX8MQ6DVAJZAB
MIMX8MQ6DVAJZABNXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
854
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N/A
MIMX8QM5AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

673
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QUOTE
N/A
MIMX8QM5AVUFFABNXP SemiconductorsMPU I.MX8 QUAD MAXMicroprocessorsN/AN/AN/A

N/A

1,844
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QUOTE
N/A
MIMX8QM6AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

702
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QUOTE
MIMX8QM6AVUFFAB
MIMX8QM6AVUFFABNXP SemiconductorsIC MPU 266MHZ/1.2/1.6GHZ 1313BGAMicroprocessors1313-BGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width:
2, 2, 4
Speed:
266MHz, 1.2GHz, 1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
LPDDR4, DRAM
Graphics Acceleration:
Yes
USB:
USB (3)
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
1313-BFBGA
Supplier Device Package:
1313-BGA (29×29)
Additional Interfaces:
SPI, UART
1,520
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QUOTE
N/AN/AMIMX8QM6AVUFFABRNXP SemiconductorsI.MX 8QUADMAXMicroprocessors1313-BGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width:
8 Core, 64-Bit
Speed:
1.6GHz, 1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
1Gbps (2)
USB:
USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Mounting Type:
Surface Mount
Package / Case:
1313-BFBGA
Supplier Device Package:
1313-BGA (29×29)
Additional Interfaces:
CANbus, I2C, SPI, UART
742
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QUOTE
N/A
MIMX8QM6CVUFFABNXP SemiconductorsMPU I.MX8 QUAD MAXMicroprocessorsN/AN/AN/A

N/A

1,267
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QUOTE
N/A
MIMX8QP5AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,892
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QUOTE
MIMX8QP5AVUFFAB
MIMX8QP5AVUFFABNXP SemiconductorsIC MPU 266MHZ/1.2/1.6GHZ 1313BGAMicroprocessors1313-BGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width:
1, 2, 4
Speed:
266MHz, 1.2GHz, 1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
LPDDR4, DRAM
Graphics Acceleration:
Yes
USB:
USB (3)
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
1313-BFBGA
Supplier Device Package:
1313-BGA (29×29)
Additional Interfaces:
SPI, UART
1,292
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QUOTE
N/A
MIMX8QP6AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,808
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QUOTE
N/A
MIMX8QP6AVUFFABNXP SemiconductorsIC MPU I.MX8Q 266MHZ 1313FCPBGAMicroprocessors1313-FCPBGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A72, Arm Cortex®-M4F
Number of Cores/Bus Width:
7 Core, 64-Bit
Speed:
1.6GHz, 1.26GHz, 266MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
1Gbps (2)
USB:
USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Mounting Type:
Surface Mount
Package / Case:
1313-BBGA, FCBGA
Supplier Device Package:
1313-FCPBGA (29×29)
Additional Interfaces:
CANbus, I2C, SPI, UART
1,862
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N/AN/AMIMX8QP6CVUFFABNXP SemiconductorsMPU I.MX8 QUAD PLUSMicroprocessorsN/AN/AN/A

N/A

722
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N/AN/AMIMX8QX1AVOFZACNXP SemiconductorsI.MX 8QUADXPLUS 17X17Microprocessors-N/A–

N/A

631
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QUOTE
N/AN/AMIMX8QX1FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
1,060
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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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