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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MIMX8MQ5CVAHZAA | NXP Semiconductors | IC MPU I.MX8MQ 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.3GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 804 | ||
 | MIMX8MQ5CVAHZAB | NXP Semiconductors | IC MPU I.MX8MQ 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.3GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,271 | ||
 | MIMX8MQ5DVAJZAA | NXP Semiconductors | IC MPU I.MX8MQ 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 309 | ||
 | MIMX8MQ5DVAJZAB | NXP Semiconductors | IC MPU I.MX8MQ 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 384 | ||
 | MIMX8MQ6CVAHZAB | NXP Semiconductors | IC MPU I.MX8MQ 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.3GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,229 | ||
 | MIMX8MQ6DVAJZAA | NXP Semiconductors | IC MPU I.MX8MQ 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 710 | ||
 | MIMX8MQ6DVAJZAB | NXP Semiconductors | IC MPU I.MX8MQ 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 903 | ||
| N/A | MIMX8QM5AVUFEAB | NXP Semiconductors | IC | Microprocessors | N/A | N/A | -40 °C – 125 °C | Speed: 1.3 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Ethernet: 1G, AVB Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Qualification: Automotive | 1,034 | ||
| N/A | MIMX8QM5AVUFFAB | NXP Semiconductors | MPU I.MX8 QUAD MAX | Microprocessors | N/A | N/A | -40 °C – 125 °C | Speed: 1.6 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 RAM Controllers: LPDDR4 Graphics Acceleration: Yes Qualification: Automotive | 366 | ||
| N/A | MIMX8QM6AVUFEAB | NXP Semiconductors | IC | Microprocessors | N/A | N/A | -40 °C – 125 °C | Speed: 1.3 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Ethernet: 1G, AVB Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Qualification: Automotive | 568 | ||
 | MIMX8QM6AVUFFAB | NXP Semiconductors | IC MPU 266MHZ/1.2/1.6GHZ 1313BGA | Microprocessors | 1313-BGA (29x29) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Number of Cores/Bus Width: 2, 2, 4 Speed: 266MHz, 1.2GHz, 1.6GHz Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: LPDDR4, DRAM Graphics Acceleration: Yes USB: USB (3) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 1313-BFBGA Supplier Device Package: 1313-BGA (29×29) | 1,693 | ||
| N/A | MIMX8QM6AVUFFABR | NXP Semiconductors | I.MX 8QUADMAX | Microprocessors | 1313-BGA (29x29) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 1.6GHz, 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 1Gbps (2) USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS Mounting Type: Surface Mount Package / Case: 1313-BFBGA Supplier Device Package: 1313-BGA (29×29) | 679 | ||
| N/A | N/A | MIMX8QM6CVUFFAB | NXP Semiconductors | MPU I.MX8 QUAD MAX | Microprocessors | N/A | N/A | -40 °C – 105 °C | Speed: 1.3 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Ethernet: 1G, AVB Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Qualification: Industrial | 666 | |
| N/A | N/A | MIMX8QP5AVUFEAB | NXP Semiconductors | IC | Microprocessors | N/A | N/A | -40 °C – 125 °C | Speed: 1.3 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Ethernet: 1G, AVB Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Qualification: Automotive | 1,575 | |
 | MIMX8QP5AVUFFAB | NXP Semiconductors | IC MPU 266MHZ/1.2/1.6GHZ 1313BGA | Microprocessors | 1313-BGA (29x29) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Number of Cores/Bus Width: 1, 2, 4 Speed: 266MHz, 1.2GHz, 1.6GHz Co-Processors/DSP: ARM® Cortex®-M4F RAM Controllers: LPDDR4, DRAM Graphics Acceleration: Yes USB: USB (3) Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 1313-BFBGA Supplier Device Package: 1313-BGA (29×29) | 553 | ||
| N/A | N/A | MIMX8QP6AVUFEAB | NXP Semiconductors | IC | Microprocessors | N/A | N/A | -40 °C – 125 °C | Speed: 1.3 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Ethernet: 1G, AVB Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Qualification: Automotive | 970 | |
| N/A | MIMX8QP6AVUFFAB | NXP Semiconductors | IC MPU I.MX8Q 266MHZ 1313FCPBGA | Microprocessors | 1313-FCPBGA (29x29) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A72, Arm Cortex®-M4F Number of Cores/Bus Width: 7 Core, 64-Bit Speed: 1.6GHz, 1.26GHz, 266MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 1Gbps (2) USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS Mounting Type: Surface Mount Package / Case: 1313-BBGA, FCBGA Supplier Device Package: 1313-FCPBGA (29×29) | 32 | ||
| N/A | N/A | MIMX8QP6CVUFFAB | NXP Semiconductors | MPU I.MX8 QUAD PLUS | Microprocessors | N/A | N/A | -40 °C – 105 °C | Speed: 1.3 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Ethernet: 1G, AVB Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Qualification: Industrial | 1,084 | |
| N/A | N/A | MIMX8QX1AVOFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 17X17 | Microprocessors | - | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 1,251 | |
| N/A | N/A | MIMX8QX1FVLFZAC | NXP Semiconductors | I.MX 8QUADXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 1,558 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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