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Microprocessors

Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.

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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/AN/AMIMX8UD7DVK08SCNXP SemiconductorsI.MX8ULP,DUAL 800MHZMicroprocessors-N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
800MHz
Co-Processors/DSP:
3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers:
LPDDR3, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
1,107
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N/A
MIMX8UD7DVP08SCNXP SemiconductorsI.MX8ULP, DUAL 800MHZMicroprocessorsN/AN/AN/A

N/A

640
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QUOTE
N/A
MIMX8US3CVP08SCNXP Semiconductors8ULP DUAL CORTEX A35MicroprocessorsN/AN/AN/A

N/A

1,073
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QUOTE
N/A
MIMX8US3DVP08SCNXP SemiconductorsI.MX8ULP,DUAL 800MHZMicroprocessors-N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
800MHz
Co-Processors/DSP:
ARM® Cortex®-M33
RAM Controllers:
LPDDR3, LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
691
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N/A
MIMX8US5CVP08SCNXP Semiconductors8ULP DUAL CORTEX A35MicroprocessorsN/AN/AN/A

N/A

1,527
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N/A
MIMX8US5DVP08SCNXP SemiconductorsI.MX8ULP, SOLO 800MHZMicroprocessorsN/AN/AN/A

N/A

1,938
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N/AN/AMIMX8UX5AVLFZACRNXP SemiconductorsI.MX 8DUALXMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, PCIe, SDHC, SPI, UART
9
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N/AN/AMIMX8UX5AVOFZACNXP SemiconductorsI.MX 8DUALX 17X17Microprocessors-N/A–

N/A

876
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MIMX8UX5CVLFZACN/AMIMX8UX5CVLFZACNXP SemiconductorsMIMX8UX5CVLFZACMicroprocessorsN/AN/AN/A

N/A

565
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N/AN/AMIMX8UX5FVLFZACNXP SemiconductorsI.MX8 QXP 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
895
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N/AN/AMIMX8UX5FVOFZACNXP SemiconductorsI.MX 8DUALX 17X17Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
473
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MIMX8UX6AVLFZAC
MIMX8UX6AVLFZACNXP SemiconductorsI.MX8 DX 21X21Microprocessors-N/A–

N/A

367
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N/AN/AMIMX8UX6AVOFZACNXP SemiconductorsI.MX8 QXP 17X17Microprocessors-N/A–

N/A

773
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MIMX8UX6CVLFZACN/AMIMX8UX6CVLFZACNXP SemiconductorsMIMX8UX6CVLFZACMicroprocessorsN/AN/AN/A

N/A

855
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N/AN/AMIMX8UX6FVLFZACNXP SemiconductorsI.MX8 QXP 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
1,187
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QUOTE
N/AN/AMIMX8UX6FVOFZACNXP SemiconductorsI.MX 8DUALX 17X17Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
307
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QUOTE
N/AN/AMIMX9111CVXXJAANXP SemiconductorsICMicroprocessors-N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.4GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
RGB
Ethernet:
GbE (1)
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
1,226
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QUOTE
N/AN/AMIMX9111DVXXJAANXP SemiconductorsICMicroprocessors-N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.4GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
RGB
Ethernet:
GbE (1)
USB:
USB 2.0 (1)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
39
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QUOTE
N/A
MIMX9131CVVXJAANXP SemiconductorsICMicroprocessors-N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.4GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
RGB
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
1,177
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QUOTE
N/A
MIMX9131DVVXJAANXP SemiconductorsICMicroprocessors-N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A55
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.4GHz
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
RGB
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
234
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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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