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Microprocessors
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | MIMXRT1182CVP2B | NXP Semiconductors | IC | Microprocessors | N/A | N/A | N/A | N/A | 1,910 | ||
| N/A | MIMXRT1187AVM8B | NXP Semiconductors | IC | Microprocessors | N/A | N/A | N/A | N/A | 646 | ||
| N/A | MIMXRT1187CVM8B | NXP Semiconductors | IC | Microprocessors | N/A | N/A | N/A | N/A | 879 | ||
![]() | MPC5200BV400 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 1,628 | ||
![]() | MPC5200CBV266 | NXP Semiconductors | IC MPU MPC52XX 266MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 594 | ||
![]() | MPC5200CBV400 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 197 | ||
![]() | MPC5200CVR266 | NXP Semiconductors | IC MPU MPC52XX 266MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 586 | ||
![]() | MPC5200CVR400 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 1,996 | ||
![]() | MPC5200CVR400B | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 1,447 | ||
![]() | MPC5200CVR400BR2 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Graphics Acceleration: No Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 1,776 | ||
![]() | MPC5200VR400 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 986 | ||
![]() | MPC5200VR400B | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | 0°C ~ 70°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (1) USB: USB 1.1 (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 550 | ||
![]() | MPC5200VR400BR2 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | 2.5V, 3.3V | 0°C – 70°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Mounting Type: Surface Mount | 565 | ||
![]() | MPC603RRX200LC | NXP Semiconductors | IC MPU MPC6XX 200MHZ 255FCCBGA | Microprocessors | 255-FCCBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Supplier Device Package: 255-FCCBGA (21×21) | 1,571 | ||
![]() | MPC603RRX200TC | NXP Semiconductors | IC MPU MPC6XX 200MHZ 255FCCBGA | Microprocessors | 255-FCCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Supplier Device Package: 255-FCCBGA (21×21) | 1,521 | ||
![]() | MPC603RRX266LC | NXP Semiconductors | IC MPU MPC6XX 266MHZ 255FCCBGA | Microprocessors | 255-FCCBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Supplier Device Package: 255-FCCBGA (21×21) | 779 | ||
![]() | MPC603RRX266TC | NXP Semiconductors | IC MPU MPC6XX 266MHZ 255FCCBGA | Microprocessors | 255-FCCBGA (21x21) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Supplier Device Package: 255-FCCBGA (21×21) | 1,049 | ||
![]() | MPC603RRX300LC | NXP Semiconductors | IC MPU MPC6XX 300MHZ 255FCCBGA | Microprocessors | 255-FCCBGA (21x21) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Supplier Device Package: 255-FCCBGA (21×21) | 1,583 | ||
![]() | MPC603RZT200LC | NXP Semiconductors | IC MPU MPC6XX 200MHZ 255BGA | Microprocessors | 255-PBGA (23x23) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 255-BBGA Supplier Device Package: 255-PBGA (23×23) | 437 | ||
![]() | MPC7410HX400LE | NXP Semiconductors | IC MPU MPC74XX 400MHZ 360CBGA | Microprocessors | 360-CBGA (25x25) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Mounting Type: Surface Mount | 1,047 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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