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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MIMX8MN1CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 490 | ||
 | MIMX8MN1DVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 306-TFBGA Supplier Device Package: 306-TFBGA (11×11) | 1,023 | ||
 | MIMX8MN1DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 957 | ||
| N/A | MIMX8MN2CVTIZAA | NXP Semiconductors | IC MPU 1.4GHZ/750MHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.4GHz, 750MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA Supplier Device Package: 486-LFBGA (14×14) | 451 | ||
 | MIMX8MN2DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 845 | ||
 | MIMX8MN3CVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 306-TFBGA Supplier Device Package: 306-TFBGA (11×11) | 1,809 | ||
 | MIMX8MN3CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 461 | ||
 | MIMX8MN3DVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 306-TFBGA Supplier Device Package: 306-TFBGA (11×11) | 938 | ||
 | MIMX8MN3DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 1,631 | ||
 | MIMX8MN4CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 588 | ||
 | MIMX8MN4DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 1,958 | ||
 | MIMX8MN5CVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 306-TFBGA Supplier Device Package: 306-TFBGA (11×11) | 280 | ||
 | MIMX8MN5CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 971 | ||
 | MIMX8MN5DVPIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 306TFBGA | Microprocessors | 306-TFBGA (11x11) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 306-TFBGA Supplier Device Package: 306-TFBGA (11×11) | 322 | ||
 | MIMX8MN5DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 458 | ||
 | MIMX8MN6CVTIZAA | NXP Semiconductors | IC MPU I.MX8MN 1.4GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 791 | ||
| N/A | N/A | MIMX8MN6DUCJZAA | NXP Semiconductors | NANO SOLOLITE I.MX 8M LFBGA486 | Microprocessors | 486-LFBGA (14x14) | N/A | 0 °C – 95 °C | Speed: 1.5 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4, LPDDR4 Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: ARM® Cortex®-M7 Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Qualification: Consumer | 1,750 | |
 | MIMX8MN6DVTJZAA | NXP Semiconductors | IC MPU I.MX8MN 1.5GHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 2.0 + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 854 | ||
| N/A | MIMX8MN6DVTJZCA | NXP Semiconductors | IC MPU 1.5GHZ/750MHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 5 Core, 64-Bit Speed: 1.5GHz, 750MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 1,238 | ||
| N/A | MIMX8MN6DVTJZDA | NXP Semiconductors | IC MPU 1.5GHZ/750MHZ 486LFBGA | Microprocessors | 486-LFBGA (14x14) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 5 Core, 64-Bit Speed: 1.5GHz, 750MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD Ethernet: GbE USB: USB 2.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14×14) | 725 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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