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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | N/A | MIMX8DX1FVLFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 1,078 | |
| N/A | N/A | MIMX8DX1FVOFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 17X17 | Microprocessors | 417-FBGA (17x17) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Package / Case: 417-BFBGA Supplier Device Package: 417-FBGA (17×17) | 811 | |
| N/A | N/A | MIMX8DX2AVOFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 17X17 | Microprocessors | - | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 81 | |
| N/A | N/A | MIMX8DX2FVLFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 1,028 | |
| N/A | N/A | MIMX8DX2FVOFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 17X17 | Microprocessors | 417-FBGA (17x17) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Package / Case: 417-BFBGA Supplier Device Package: 417-FBGA (17×17) | 957 | |
| N/A | N/A | MIMX8DX5AVLFZACR | NXP Semiconductors | I.MX 8DUALXPLUS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 1,120 | |
 | N/A | MIMX8DX5CVLFZAC | NXP Semiconductors | MIMX8DX5CVLFZAC | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 522 | |
| N/A | N/A | MIMX8DX5FVLFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 1,278 | |
| N/A | N/A | MIMX8DX5GVLFZAC | NXP Semiconductors | I.MX 8X FIPS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 947 | |
 | N/A | MIMX8DX6CVLFZAC | NXP Semiconductors | MIMX8DX6CVLFZAC | Microprocessors | N/A | N/A | N/A | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI | 380 | |
| N/A | N/A | MIMX8DX6FVLFZAC | NXP Semiconductors | I.MX 8DUALXPLUS 21X21 | Microprocessors | 609-FBGA (21x21) | N/A | – | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 678 | |
| N/A | N/A | MIMX8DX6GVLFZAC | NXP Semiconductors | I.MX 8X FIPS | Microprocessors | 609-FBGA (21x21) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Mounting Type: Surface Mount Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21×21) | 742 | |
 | MIMX8MD6CVAHZAA | NXP Semiconductors | IC MPU I.MX8MD 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.3GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 408 | ||
 | MIMX8MD6CVAHZAB | NXP Semiconductors | IC MPU I.MX8MD 1.3GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.3GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 1,140 | ||
 | MIMX8MD6DVAJZAA | NXP Semiconductors | IC MPU I.MX8MD 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 891 | ||
 | MIMX8MD6DVAJZAB | NXP Semiconductors | IC MPU I.MX8MD 1.5GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Ethernet: GbE USB: USB 3.0 (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) | 852 | ||
 | MIMX8ML3CVNKZAB | NXP Semiconductors | IC MPU I.MX8ML 1.6GHZ 548LFBGA | Microprocessors | 548-LFBGA (15x15) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Ethernet: GbE (2) USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, RDC Mounting Type: Surface Mount Package / Case: 548-LFBGA Supplier Device Package: 548-LFBGA (15×15) | 611 | ||
 | MIMX8ML3DVNLZAB | NXP Semiconductors | IC MPU I.MX8ML 1.8GHZ 548LFBGA | Microprocessors | 548-LFBGA (15x15) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Ethernet: GbE (2) USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, RDC Mounting Type: Surface Mount Package / Case: 548-LFBGA Supplier Device Package: 548-LFBGA (15×15) | 491 | ||
 | MIMX8ML4CVNKZAB | NXP Semiconductors | IC MPU I.MX8ML 1.8GHZ 548LFBGA | Microprocessors | 548-LFBGA (15x15) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Ethernet: GbE (2) USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, RDC Mounting Type: Surface Mount Package / Case: 548-LFBGA Supplier Device Package: 548-LFBGA (15×15) | 553 | ||
 | MIMX8ML4DVNLZAB | NXP Semiconductors | IC MPU I.MX8ML 1.8GHZ 548LFBGA | Microprocessors | 548-LFBGA (15x15) | N/A | 0°C ~ 95°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Ethernet: GbE (2) USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, RDC Mounting Type: Surface Mount Package / Case: 548-LFBGA Supplier Device Package: 548-LFBGA (15×15) | 518 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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