Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX7D5EVM10SCN/AMCIMX7D5EVM10SCNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
1,146
MCIMX7D5EVM10SD
MCIMX7D5EVM10SDNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
638
MCIMX7D7DVK10SC
MCIMX7D7DVK10SCNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
125
MCIMX7D7DVK10SDN/AMCIMX7D7DVK10SDNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
89
MCIMX7D7DVM10SC
MCIMX7D7DVM10SCNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
240
MCIMX7D7DVM10SDN/AMCIMX7D7DVM10SDNXP SemiconductorsIC MPU I.MX7D 1.0GHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
662
MCIMX7S3DVK08SC
MCIMX7S3DVK08SCNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
467
MCIMX7S3DVK08SDN/AMCIMX7S3DVK08SDNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
672
N/A
MCIMX7S3EVK08SCNXP SemiconductorsIC MPU 800MHZ 488MAPBGAMicroprocessors488-MAPBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-MAPBGA (12×12)
Additional Interfaces:
AC’97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
1,557
MCIMX7S3EVK08SDN/AMCIMX7S3EVK08SDNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
307
MCIMX7S5EVK08SC
MCIMX7S5EVK08SCNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
1,101
MCIMX7S5EVK08SDN/AMCIMX7S5EVK08SDNXP SemiconductorsIC MPU I.MX7S 800MHZ 488TFBGAMicroprocessors488-TFBGA (12x12)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
488-TFBGA
Supplier Device Package:
488-TFBGA (12×12)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
495
MCIMX7S5EVM08SCN/AMCIMX7S5EVM08SCNXP SemiconductorsIC MPU I.MX7S 800MHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
663
MCIMX7S5EVM08SD
MCIMX7S5EVM08SDNXP SemiconductorsIC MPU I.MX7S 800MHZ 541MAPBGAMicroprocessors541-MAPBGA (19x19)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
541-LFBGA
Supplier Device Package:
541-MAPBGA (19×19)
Additional Interfaces:
AC’97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
920
MCIMX7U3CVP06SC
MCIMX7U3CVP06SCNXP SemiconductorsIC MPU I.MX7ULP 650MHZMicroprocessorsN/AN/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 105°C
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces:
FlexIO, GPIO, I2C, I2S, SPI, UART
1,062
MCIMX7U3CVP06SD
MCIMX7U3CVP06SDNXP SemiconductorsIC I.MX 7ULP MAPBGA 393MicroprocessorsN/AN/AN/A

N/A

159
MCIMX7U3DVK07SC
MCIMX7U3DVK07SCNXP SemiconductorsIC MPU I.MX7ULP 720MHZMicroprocessorsN/AN/A0°C ~ 95°C
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces:
FlexIO, GPIO, I2C, I2S, SPI, UART
236
N/A
MCIMX7U3DVK07SDNXP SemiconductorsIC MPU I.MX7ULP 720MHZ 361VFBGAMicroprocessors361-VFBGA (10x10)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Mounting Type:
Surface Mount
Package / Case:
361-VFBGA
Supplier Device Package:
361-VFBGA (10×10)
Additional Interfaces:
FlexIO, GPIO, I2C, I2S, SPI, UART
8
MCIMX7U5CVP06SC
MCIMX7U5CVP06SCNXP SemiconductorsIC MPU I.MX7ULP 650MHZMicroprocessorsN/AN/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
-40°C ~ 105°C
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces:
FlexIO, GPIO, I2C, I2S, SPI, UART
351
MCIMX7U5DVK07SC
MCIMX7U5DVK07SCNXP SemiconductorsIC MPU I.MX7ULP 720MHZMicroprocessorsN/AN/A0°C ~ 95°C
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-DSI
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C
Security Features:
Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces:
FlexIO, GPIO, I2C, I2S, SPI, UART
887

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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