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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPC8245LZU300D | NXP Semiconductors | IC MPU MPC82XX 300MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) | 1,129 | ||
 | MPC8245LZU333D | NXP Semiconductors | RISC MICROCONTROLLER, 32-BIT, PO | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Graphics Acceleration: No Mounting Type: Surface Mount Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Package / Case: 352-LBGA RAM Controllers: SDRAM Speed: 333MHz Supplier Device Package: 352-TBGA (35×35) Voltage – I/O: 3.3V | 1,492 | ||
 | MPC8245LZU350D | NXP Semiconductors | IC MPU MPC82XX 350MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) | 875 | ||
 | MPC8245TVV266D | NXP Semiconductors | IC MPU MPC82XX 266MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) | 891 | ||
 | MPC8245TVV300D | NXP Semiconductors | IC MPU MPC82XX 300MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) | 369 | ||
 | MPC8245TVV300D-NXP | NXP Semiconductors | RISC MICROPROCESSOR, 32 BIT, PO | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC™ MPC603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) | 36 | ||
 | MPC8245TVV333D | NXP Semiconductors | IC MPU MPC82XX 333MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) | 1,241 | ||
 | MPC8245TVV350D | NXP Semiconductors | IC MPU MPC82XX 350MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) | 705 | ||
| N/A | MPC8245TZU266D | NXP Semiconductors | IC MPU MPC82XX 266MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Exposed Pad Supplier Device Package: 352-TBGA (35×35) | 763 | ||
| N/A | MPC8245TZU300D | NXP Semiconductors | IC MPU MPC82XX 300MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Exposed Pad Supplier Device Package: 352-TBGA (35×35) | 1,016 | ||
 | MPC8245TZU333D | NXP Semiconductors | IC MPU MPC82XX 333MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz RAM Controllers: SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) | 654 | ||
 | MPC8245TZU350D | NXP Semiconductors | 32 BIT POWER ARCHITECTURE, 350MH | Microprocessors | 352-TBGA (35x35) | N/A | -40 °C – 105 °C | Speed: 350 MHz Voltage – I/O: 3.3 V Core Processor: 603e Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Qualification: Industrial | 399 | ||
 | MPC8247CVRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,864 | ||
 | MPC8247CVRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,049 | ||
 | MPC8247CZQMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 338 | ||
 | MPC8247CZQTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 417 | ||
 | MPC8247VRMIBA | NXP Semiconductors | IC MPU MPC82XX 266MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 935 | ||
 | MPC8247VRPIEA | NXP Semiconductors | IC MPU MPC82XX 300MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,635 | ||
 | MPC8247VRTIEA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 807 | ||
 | MPC8247VRTMFA | NXP Semiconductors | IC MPU MPC82XX 400MHZ PBGA516 | Microprocessors | 516-PBGA (27x27) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 516-BBGA Supplier Device Package: 516-PBGA (27×27) | 1,935 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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