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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | N/A | KMPC8378ECVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | -40°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Mounting Type: Surface Mount | 960 | |
 | KMPC8379EVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Mounting Type: Surface Mount | 1,219 | ||
 | KMPC852TCVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART | 993 | ||
 | KMPC852TVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART | 756 | ||
 | KMPC8533EVTAQG | NXP Semiconductors | IC MPU MPC85XX 1.0GHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Mounting Type: Surface Mount | 27 | ||
 | KMPC8560CVT667JB | NXP Semiconductors | IC MPU MPC85XX 667MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART | 1,187 | ||
 | KMPC8560PX833LC | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART | 220 | ||
 | KMPC8560VT833LB | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BFBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART | 1,000 | ||
 | KMPC8560VT833LC | NXP Semiconductors | IC MPU MPC85XX 833MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Mounting Type: Surface Mount | 640 | ||
 | KMPC860PCZQ66D4 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4), 10/100Mbps (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 1,338 | ||
 | KMPC860SRCVR50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 107 | ||
 | KMPC860TCVR50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4), 10/100Mbps (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 848 | ||
 | KMPC860TCZQ50D4 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4), 10/100Mbps (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 1,714 | ||
 | KMPC860TVR80D4 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4), 10/100Mbps (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 757 | ||
 | KMPC862PVR100B | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4), 10/100Mbps (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 798 | ||
 | KMPC866PVR133A | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4), 10/100Mbps (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 704 | ||
 | KMPC866TVR133A | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4), 10/100Mbps (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 1,571 | ||
 | KMPC875CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 3 | ||
 | KMPC875VR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 692 | ||
 | KMPC885CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 75 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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