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Total Products: 279
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
PCX755BVZFU350LEMicrochip TechnologyIC MPU 350MHZ 360BGAMicroprocessors360-PBGA (25x25)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
350MHz
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
360-BBGA Exposed Pad
Supplier Device Package:
360-PBGA (25×25)
465
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N/A
PCX8240VTPU200EMicrochip TechnologyIC MPU 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
Additional Interfaces:
I2C, I²O, PCI
550
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N/A
PCX8240VTPU200EZD3Microchip TechnologyIC MPU 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A-40°C ~ 110°C (TJ)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
Additional Interfaces:
I2C, I²O, PCI
74
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N/AN/ARM5231A-350P-B002Microchip TechnologyIC MPU 350MHZMicroprocessors-N/A–
Core Processor:
MIPS RISC
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
350MHz
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Additional Interfaces:
PCI
598
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N/AN/ARM7035C-600L-D004Microchip TechnologyIC MPU 600MHZMicroprocessorsN/AN/A–
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
600MHz
RAM Controllers:
DDR, SDRAM
Voltage – I/O:
2.5V, 3.3V
Additional Interfaces:
PCI
1,127
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N/AN/ARM7065C-466G-D004Microchip TechnologyIC MPU 466MHZMicroprocessorsN/AN/A–
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
466MHz
RAM Controllers:
DDR, SDRAM
Voltage – I/O:
2.5V, 3.3V
Additional Interfaces:
PCI
766
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N/AN/ARM7065C-600G-D004Microchip TechnologyIC MPU 600MHZMicroprocessorsN/AN/A–
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
600MHz
RAM Controllers:
DDR, SDRAM
Voltage – I/O:
2.5V, 3.3V
Additional Interfaces:
PCI
266
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RNG90-MAVDA-T
RNG90-MAVDA-TMicrochip TechnologyFIPS RNG, 105C, I2C, 5K, UDFNMicroprocessors8-UDFN (2x3)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
8-UFDFN Exposed Pad
Supplier Device Package:
8-UDFN (2×3)
348
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N/A
RNG90-SSVDA-TMicrochip TechnologyFIPS RNG, 105C, I2C, SOICMicroprocessorsN/AN/AN/A

N/A

355
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SAM9X60-V/DWB
SAM9X60-V/DWBMicrochip TechnologyIC MPU SAM9X60 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
624
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QUOTE
SAM9X60-V/DWBVAO
SAM9X60-V/DWBVAOMicrochip TechnologyIC MPU SAM9X 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
12
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SAM9X60D1G-I/4FB
SAM9X60D1G-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
256
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QUOTE
SAM9X60D1G-I/LZB
SAM9X60D1G-I/LZBMicrochip TechnologyIC MPU SAM9X 600MHZMicroprocessors-N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
333
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QUOTE
SAM9X60D1GT-I/4FB
SAM9X60D1GT-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
1,375
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SAM9X60D5M-I/4FB
SAM9X60D5M-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
427
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QUOTE
SAM9X60D5MT-I/4FB
SAM9X60D5MT-I/4FBMicrochip TechnologyIC MPU SAM9X60 600MHZ 233TFBGAMicroprocessors233-TFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
233-TFBGA
Supplier Device Package:
233-TFBGA (14×14)
1,370
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SAM9X60D6K-I/4GB
SAM9X60D6K-I/4GBMicrochip TechnologyIC MPU SAM9X 600MHZ 196TFBGAMicroprocessors196-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
SDR, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
196-TFBGA
Supplier Device Package:
196-TFBGA (11×11)
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
1,317
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QUOTE
SAM9X60D6KT-I/4GB
SAM9X60D6KT-I/4GBMicrochip TechnologyIC MPU SAM9X 600MHZ 196TFBGAMicroprocessors196-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
SDR, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
196-TFBGA
Supplier Device Package:
196-TFBGA (11×11)
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
242
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SAM9X60T-V/DWB
SAM9X60T-V/DWBMicrochip TechnologyIC MPU SAM9X60 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
112
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QUOTE
SAM9X60T-V/DWBVAO
SAM9X60T-V/DWBVAOMicrochip TechnologyIC MPU SAM9X 600MHZ 228TFBGAMicroprocessors228-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
RAM Controllers:
DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keyboard, LCD, Touchscreen
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 (5)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Mounting Type:
Surface Mount
Package / Case:
228-TFBGA
Supplier Device Package:
228-TFBGA (11×11)
Additional Interfaces:
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
1,456
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