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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
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MCIMX6U6AVM08AD
MCIMX6U6AVM08ADNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
535
MCIMX6U6AVM08ADR
MCIMX6U6AVM08ADRNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
1,670
MCIMX6U6AVM10AC
MCIMX6U6AVM10ACNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
551
MCIMX6U6AVM10ACR
MCIMX6U6AVM10ACRNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
1,636
MCIMX6U6AVM10AD
MCIMX6U6AVM10ADNXP SemiconductorsIC MPU I.MX6DL 1GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
152
N/AN/AMCIMX6U6AVM10ADRNXP SemiconductorsI.MX 6 SERIES 32-BIT MPU, DUAL AMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
Bluetooth, CANbus, ESAI, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
141
MCIMX6U7CVM08AB
MCIMX6U7CVM08ABNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
282
MCIMX6U7CVM08AC
MCIMX6U7CVM08ACNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
381
MCIMX6U7CVM08AD
MCIMX6U7CVM08ADNXP SemiconductorsIC MPU I.MX6DL 800MHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
175
MCIMX6U8DVM10AB
MCIMX6U8DVM10ABNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
1,134
MCIMX6U8DVM10AC
MCIMX6U8DVM10ACNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
1,638
MCIMX6U8DVM10ADN/AMCIMX6U8DVM10ADNXP SemiconductorsIC MPU I.MX6DL 1.0GHZ 624MAPBGAMicroprocessors624-MAPBGA (21x21)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA
Supplier Device Package:
624-MAPBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
473
MCIMX6V2CVM08AB
MCIMX6V2CVM08ABNXP SemiconductorsIC MPU I.MX6SLL 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
190
MCIMX6V7DVN10AB
MCIMX6V7DVN10ABNXP SemiconductorsIC MPU I.MX6SLL 1GHZ 432MAPBGAMicroprocessors432-MAPBGA (13x13)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
USB:
USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
A-HAB, ARM TZ, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
432-TFBGA
Supplier Device Package:
432-MAPBGA (13×13)
919
MCIMX6X1AVK08AB
MCIMX6X1AVK08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
1,209
MCIMX6X1AVK08AC
MCIMX6X1AVK08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
752
MCIMX6X1AVO08AB
MCIMX6X1AVO08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
1,222
N/A
MCIMX6X1AVO08ACNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
905
N/A
MCIMX6X1AVO08ACRNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (17×17)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
1,430
MCIMX6X1CVK08AB
MCIMX6X1CVK08ABNXP SemiconductorsIC MPU I.MX6SX 800MHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
200MHz, 800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
Additional Interfaces:
AC’97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
275

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