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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
MIMX8MQ5CVAHZAA
MIMX8MQ5CVAHZAANXP SemiconductorsIC MPU I.MX8MQ 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
162
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MIMX8MQ5CVAHZAB
MIMX8MQ5CVAHZABNXP SemiconductorsIC MPU I.MX8MQ 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
564
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QUOTE
MIMX8MQ5DVAJZAA
MIMX8MQ5DVAJZAANXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
388
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QUOTE
MIMX8MQ5DVAJZAB
MIMX8MQ5DVAJZABNXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
842
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QUOTE
MIMX8MQ6CVAHZAB
MIMX8MQ6CVAHZABNXP SemiconductorsIC MPU I.MX8MQ 1.3GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.3GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
574
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QUOTE
MIMX8MQ6DVAJZAA
MIMX8MQ6DVAJZAANXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
1,233
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QUOTE
MIMX8MQ6DVAJZAB
MIMX8MQ6DVAJZABNXP SemiconductorsIC MPU I.MX8MQ 1.5GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.5GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3L, DDR4, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
eDP, HDMI, MIPI-CSI, MIPI-DSI
Ethernet:
GbE
USB:
USB 3.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Security Features:
ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
854
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QUOTE
N/A
MIMX8QM5AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

989
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QUOTE
N/A
MIMX8QM5AVUFFABNXP SemiconductorsMPU I.MX8 QUAD MAXMicroprocessorsN/AN/AN/A

N/A

1,844
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QUOTE
N/A
MIMX8QM6AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

702
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QUOTE
MIMX8QM6AVUFFAB
MIMX8QM6AVUFFABNXP SemiconductorsIC MPU 266MHZ/1.2/1.6GHZ 1313BGAMicroprocessors1313-BGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width:
2, 2, 4
Speed:
266MHz, 1.2GHz, 1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
LPDDR4, DRAM
Graphics Acceleration:
Yes
USB:
USB (3)
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
1313-BFBGA
Supplier Device Package:
1313-BGA (29×29)
Additional Interfaces:
SPI, UART
1,520
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QUOTE
N/AN/AMIMX8QM6AVUFFABRNXP SemiconductorsI.MX 8QUADMAXMicroprocessors1313-BGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width:
8 Core, 64-Bit
Speed:
1.6GHz, 1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
1Gbps (2)
USB:
USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Mounting Type:
Surface Mount
Package / Case:
1313-BFBGA
Supplier Device Package:
1313-BGA (29×29)
Additional Interfaces:
CANbus, I2C, SPI, UART
742
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QUOTE
N/A
MIMX8QM6CVUFFABNXP SemiconductorsMPU I.MX8 QUAD MAXMicroprocessorsN/AN/AN/A

N/A

1,267
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QUOTE
N/A
MIMX8QP5AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,892
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QUOTE
MIMX8QP5AVUFFAB
MIMX8QP5AVUFFABNXP SemiconductorsIC MPU 266MHZ/1.2/1.6GHZ 1313BGAMicroprocessors1313-BGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Number of Cores/Bus Width:
1, 2, 4
Speed:
266MHz, 1.2GHz, 1.6GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
LPDDR4, DRAM
Graphics Acceleration:
Yes
USB:
USB (3)
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
1313-BFBGA
Supplier Device Package:
1313-BGA (29×29)
Additional Interfaces:
SPI, UART
222
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QUOTE
N/A
MIMX8QP6AVUFEABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,808
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QUOTE
N/A
MIMX8QP6AVUFFABNXP SemiconductorsIC MPU I.MX8Q 266MHZ 1313FCPBGAMicroprocessors1313-FCPBGA (29x29)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-A72, Arm Cortex®-M4F
Number of Cores/Bus Width:
7 Core, 64-Bit
Speed:
1.6GHz, 1.26GHz, 266MHz
Co-Processors/DSP:
Multimedia; NEON
RAM Controllers:
LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
1Gbps (2)
USB:
USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Mounting Type:
Surface Mount
Package / Case:
1313-BBGA, FCBGA
Supplier Device Package:
1313-FCPBGA (29×29)
Additional Interfaces:
CANbus, I2C, SPI, UART
1,862
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QUOTE
N/AN/AMIMX8QP6CVUFFABNXP SemiconductorsMPU I.MX8 QUAD PLUSMicroprocessorsN/AN/AN/A

N/A

722
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QUOTE
N/AN/AMIMX8QX1AVOFZACNXP SemiconductorsI.MX 8QUADXPLUS 17X17Microprocessors-N/A–

N/A

631
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QUOTE
N/AN/AMIMX8QX1FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
1,060
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QUOTE

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