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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/AN/AMIMX8QX1FVOFZACNXP SemiconductorsI.MX 8QUADXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
962
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QUOTE
N/AN/AMIMX8QX2AVOFZACNXP SemiconductorsI.MX8 QXP 17X17Microprocessors-N/A–

N/A

1,067
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QUOTE
N/AN/AMIMX8QX2FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
567
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QUOTE
N/AN/AMIMX8QX2FVOFZACNXP SemiconductorsI.MX 8QUADXPLUS 17X17Microprocessors417-FBGA (17x17)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
417-BFBGA
Supplier Device Package:
417-FBGA (17×17)
232
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QUOTE
MIMX8QX5CVLFZACN/AMIMX8QX5CVLFZACNXP SemiconductorsMIMX8QX5CVLFZACMicroprocessorsN/AN/AN/A

N/A

1,786
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QUOTE
N/AN/AMIMX8QX5FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
352
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QUOTE
N/AN/AMIMX8QX5GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
798
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QUOTE
MIMX8QX6AVLFZAC
MIMX8QX6AVLFZACNXP SemiconductorsIC MPU 609FBGAMicroprocessors609-FBGA (21x21)N/A–
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
43
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QUOTE
MIMX8QX6CVLFZACN/AMIMX8QX6CVLFZACNXP SemiconductorsMIMX8QX6CVLFZACMicroprocessorsN/AN/AN/A

N/A

1,609
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QUOTE
N/AN/AMIMX8QX6FVLFZACNXP SemiconductorsI.MX 8QUADXPLUS 21X21Microprocessors609-FBGA (21x21)N/A–
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
517
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QUOTE
N/AN/AMIMX8QX6GVLFZACNXP SemiconductorsI.MX 8X FIPSMicroprocessors609-FBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width:
3 Core, 64-Bit
Speed:
1.2GHz, 264MHz
Co-Processors/DSP:
Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Mounting Type:
Surface Mount
Package / Case:
609-BFBGA
Supplier Device Package:
609-FBGA (21×21)
Additional Interfaces:
CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
990
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QUOTE
N/AN/AMIMX8SL1AVNFZABNXP SemiconductorsI.MX8 DXL 15SQMicroprocessors388-LBGA (15x15)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
1Gbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
388-LFBGA
Supplier Device Package:
388-LBGA (15×15)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
1,243
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QUOTE
N/AN/AMIMX8SL1CVNFZABNXP SemiconductorsI.MX 8DUALXLITE 15SQMicroprocessors388-LBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
1 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
ARM® Cortex®-M4F
RAM Controllers:
DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
1Gbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
Mounting Type:
Surface Mount
Package / Case:
388-LFBGA
Supplier Device Package:
388-LBGA (15×15)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
219
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QUOTE
N/AN/AMIMX8SL1CVNFZBANXP SemiconductorsI.MX8SOLOLXLITE 15SQMicroprocessorsN/AN/AN/A

N/A

411
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QUOTE
N/A
MIMX8UD3CVP08SCNXP Semiconductors8ULP DUAL CORTEX A35MicroprocessorsN/AN/AN/A

N/A

32
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QUOTE
N/A
MIMX8UD3DVP08SCNXP SemiconductorsI.MX8ULP, DUAL 800MHZMicroprocessorsN/AN/AN/A

N/A

304
GET A
QUOTE
N/A
MIMX8UD5CVP08SCNXP Semiconductors8ULP DUAL CORTEX A35MicroprocessorsN/AN/AN/A

N/A

700
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QUOTE
N/AN/AMIMX8UD5DVK08SCNXP SemiconductorsI.MX8ULP,DUAL 800MHZMicroprocessors-N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
800MHz
Co-Processors/DSP:
3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers:
LPDDR3, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
788
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QUOTE
N/A
MIMX8UD5DVP08SCNXP SemiconductorsI.MX8ULP,DUAL 800MHZMicroprocessors-N/A0°C ~ 95°C (TJ)
Core Processor:
ARM® Cortex®-A35
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
800MHz
Co-Processors/DSP:
3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
RAM Controllers:
LPDDR3, LPDDR4
Graphics Acceleration:
Yes
Display & Interface Controllers:
MIPI-CSI, MIPI-DSI
Ethernet:
10/100Mbps
USB:
USB 2.0 (2)
Operating Temperature:
0°C ~ 95°C (TJ)
Additional Interfaces:
I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
619
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QUOTE
N/A
MIMX8UD7CVP08SCNXP SemiconductorsI.MX8ULP, DUAL 800MHZMicroprocessorsN/AN/AN/A

N/A

1,823
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QUOTE

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