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| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | N/A | S32G399ASAK1VUCT | NXP Semiconductors | 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, TRNG Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 413 | |
| N/A | N/A | S32G399ASBK1VUCT | NXP Semiconductors | 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 1.1GHz, 400MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 1,026 | |
| N/A | N/A | S32G399ASCK1VUCR | NXP Semiconductors | 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 415 | |
| N/A | N/A | S32G399ASCK1VUCT | NXP Semiconductors | 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART | 858 | |
 | S80C186-20 | Advanced Micro Devices | IC MPU I186 20MHZ | Microprocessors | N/A | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 20MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) | 1,061 | ||
 | S80C186EB25 | Intel | IC MPU I186 25MHZ 80QFP | Microprocessors | 80-PQFP (14x20) | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 25MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14×20) | 829 | ||
 | S80C188-20 | Advanced Micro Devices | IC MPU I186 20MHZ | Microprocessors | N/A | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 20MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) | 1,579 | ||
 | S80L186EB16 | Intel | IC MPU I186 16MHZ 80QFP | Microprocessors | 80-PQFP (14x20) | N/A | 0°C ~ 70°C (TA) | Core Processor: 80C186 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 16MHz RAM Controllers: DRAM Graphics Acceleration: No Voltage – I/O: 3.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14×20) | 658 | ||
 | SAM9X60-V/DWB | Microchip Technology | IC MPU SAM9X60 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) | 624 | ||
 | SAM9X60-V/DWBVAO | Microchip Technology | IC MPU SAM9X 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 12 | ||
 | SAM9X60D1G-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) | 256 | ||
 | SAM9X60D1G-I/LZB | Microchip Technology | IC MPU SAM9X 600MHZ | Microprocessors | - | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 333 | ||
 | SAM9X60D1GT-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) | 1,375 | ||
 | SAM9X60D5M-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) | 427 | ||
 | SAM9X60D5MT-I/4FB | Microchip Technology | IC MPU SAM9X60 600MHZ 233TFBGA | Microprocessors | 233-TFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) | 1,370 | ||
 | SAM9X60D6K-I/4GB | Microchip Technology | IC MPU SAM9X 600MHZ 196TFBGA | Microprocessors | 196-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 196-TFBGA Supplier Device Package: 196-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1,317 | ||
 | SAM9X60D6KT-I/4GB | Microchip Technology | IC MPU SAM9X 600MHZ 196TFBGA | Microprocessors | 196-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 196-TFBGA Supplier Device Package: 196-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 242 | ||
 | SAM9X60T-V/DWB | Microchip Technology | IC MPU SAM9X60 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) | 112 | ||
 | SAM9X60T-V/DWBVAO | Microchip Technology | IC MPU SAM9X 600MHZ 228TFBGA | Microprocessors | 228-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1,456 | ||
 | SAM9X70-I/4PB | Microchip Technology | ARM926 MPU,BGA,I TEMP,TRAY | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB | 1,196 |
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