 | N/A | AGLE3000V2-FGG484I | Microchip Technology | IC FPGA 341 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.14 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 75264 Number of Logic Elements/Cells: 75264 | 210 | |
 | N/A | AGLE3000V5-FG484 | Microchip Technology | IC FPGA 341 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 75264 Number of Logic Elements/Cells: 75264 | 1,521 | |
 | | AGLE3000V5-FG484I | Microchip Technology | IC FPGA 341 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Number of Logic Elements/Cells: 75264 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,842 | |
 | | AGLE3000V5-FGG484 | Microchip Technology | IC FPGA 341 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of Logic Elements/Cells: 75264 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 632 | |
 | N/A | AGLE3000V5-FGG484I | Microchip Technology | IC FPGA 341 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 75264 Number of Logic Elements/Cells: 75264 | 348 | |
 | | AGLE600V2-FG256 | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.14V ~ 1.575V | 0°C ~ 70°C (TA) | Number of Logic Elements/Cells: 13824 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 256-FPBGA (17×17) | 1,089 | |
 | N/A | AGLE600V2-FG256I | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.14 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 32 | |
 | | AGLE600V2-FGG256 | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.14V ~ 1.575V | 0°C ~ 70°C (TA) | Number of Logic Elements/Cells: 13824 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 256-FPBGA (17×17) | 650 | |
 | N/A | AGLE600V2-FGG256I | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.14 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 1,136 | |
 | | AGLE600V5-FG256 | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of Logic Elements/Cells: 13824 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 256-FPBGA (17×17) | 1,031 | |
 | N/A | AGLE600V5-FG256I | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | -40°C – 85°C | Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 | 731 | |
 | | AGLE600V5-FGG256 | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of Logic Elements/Cells: 13824 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 256-FPBGA (17×17) | 334 | |
 | | AGLE600V5-FGG256I | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Number of Logic Elements/Cells: 13824 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 256-FPBGA (17×17) | 859 | |
 | | AGLN010V2-QNG48 | Microchip Technology | IC FPGA 34 I/O 48QFN | FPGAs | 48-QFN (6x6) | 1.14 V - 1.575 V | -20°C – 85°C | Number of Logic Elements/Cells: 260 | 158 | |
 | | AGLN010V2-QNG48I | Microchip Technology | IC FPGA 34 I/O 48QFN | FPGAs | 48-QFN (6x6) | 1.14V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 260 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (6×6) | 951 | |
 | | AGLN010V2-UCG36 | Microchip Technology | IC FPGA 23 I/O 36UCSP | FPGAs | 36-UCSP (3x3) | 1.14 V - 1.575 V | -20°C – 85°C | Number of Logic Elements/Cells: 260 | 897 | |
 | | AGLN010V2-UCG36I | Microchip Technology | IC FPGA 23 I/O 36UCSP | FPGAs | 36-UCSP (3x3) | 1.14V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 260 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 36-WFBGA, CSPBGA Supplier Device Package: 36-UCSP (3×3) | 179 | |
 | | AGLN010V5-QNG48 | Microchip Technology | IC FPGA 34 I/O 48QFN | FPGAs | 48-QFN (6x6) | 1.425 V - 1.575 V | -20°C – 85°C | Number of Logic Elements/Cells: 260 | 383 | |
 | | AGLN010V5-QNG48I | Microchip Technology | IC FPGA 34 I/O 48QFN | FPGAs | 48-QFN (6x6) | 1.425 V - 1.575 V | -40°C – 100°C | Number of Logic Elements/Cells: 260 | 32 | |
 | | AGLN010V5-UCG36 | Microchip Technology | IC FPGA 23 I/O 36UCSP | FPGAs | 36-UCSP (3x3) | 1.425V ~ 1.575V | -20°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 260 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TJ) Package / Case: 36-WFBGA, CSPBGA Supplier Device Package: 36-UCSP (3×3) | 387 | |