 | | X4MF04207SPZQQ1 | Texas Instruments | IC MCU 16/32B 448KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CANbus, LINbus, MibSPI, SCI, UART/USART Program Memory Size: 448KB (448K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.7V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,502 | |
 | N/A | X5LS20216ASZWTQQ1 | Texas Instruments | IC MCU 16/32B 2MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,571 | |
 | N/A | X5LS20216SPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 2MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 20x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,191 | |
 | N/A | XA1243FPBGABL | Texas Instruments | IC RF TXRX+MCU 161LFBGA | RF Transceiver ICs | 161-FC/CSP (10.4x10.4) | 1.71V ~ 1.89V, 3.15V ~ 3.45V | -40°C ~ 125°C (TJ) | Serial Interfaces: SPI, UART Voltage – Supply: 1.71V ~ 1.89V, 3.15V ~ 3.45V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 161-LFBGA, FCBGA Supplier Device Package: 161-FC/CSP (10.4×10.4) | 1,600 | |
 | N/A | XA2S100E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 2700 | 709 | |
 | N/A | XA2S100E-6TQ144I | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 1,152 | |
 | N/A | XA2S100E-6TQ144Q | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 2700 | 352 | |
 | N/A | XA2S150E-6FT256I | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 3888 | 349 | |
 | N/A | XA2S150E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 3888 | 348 | |
 | N/A | XA2S200E-6FT256I | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 235 | |
 | N/A | XA2S200E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 5292 | 50 | |
 | N/A | XA2S300E-6FT256I | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 1,091 | |
 | N/A | XA2S300E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 6912 | 769 | |
 | N/A | XA2S50E-6TQ144I | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 1728 | 1,302 | |
 | N/A | XA2S50E-6TQ144Q | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 1728 | 1,106 | |
 | | XA3S1000-4FGG456I | Advanced Micro Devices | IC FPGA 333 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 17280 | 1,635 | |
 | | XA3S1000-4FGG456Q | Advanced Micro Devices | IC FPGA 333 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 125°C | Number of Logic Elements/Cells: 17280 | 795 | |
 | | XA3S1000-4FTG256I | Advanced Micro Devices | IC FPGA 173 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 17280 | 1,122 | |
 | | XA3S1000-4FTG256Q | Advanced Micro Devices | IC FPGA 173 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.14 V - 1.26 V | -40°C – 125°C | Number of Logic Elements/Cells: 17280 | 142 | |
 | | XA3S100E-4TQG144Q | Advanced Micro Devices | IC FPGA 108 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.14 V - 1.26 V | -40°C – 125°C | Number of Logic Elements/Cells: 2160 | 1,361 | |