10AX057H2F34E2LG

The 10AX057H2F34E2LG is an Intel Arria 10 GX field programmable gate array in a 1152-FCBGA (35×35) package intended for mid-range, high-performance applications. Built on the Arria 10 device family architecture, it combines large logic capacity, substantial embedded RAM, rich I/O, and advanced transceiver and hard-IP capabilities suitable for communications, broadcast, compute acceleration, and other data‑centric systems.

Key Features

• Logic Capacity — 570,000 logic elements provide significant programmable capacity for complex combinational and sequential logic implementations.
• Embedded Memory — 42,082,304 total RAM bits of on-chip memory to support buffering, caches, and large in‑FPGA data structures.
• I/O Density — 492 I/O pins to enable extensive external interfacing and multi‑channel connectivity.
• Package & Mounting — 1152‑BBGA / 1152‑FCBGA (35×35) surface‑mount package for compact board integration and high pin‑count routing.
• Power Supply — Core voltage range of 870 mV to 980 mV for system power planning and regulator selection.
• Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
• Arria 10 Device Family Capabilities — Built on a 20 nm mid‑range FPGA/SoC platform with features such as adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, clock networks and PLLs, and low‑power serial transceivers.
• Hard IP & Protocol Support — Device family includes PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, supporting high‑speed serial protocols and external memory interfaces.
• SoC & Reconfiguration — The Arria 10 family supports SoC hard processor system integration, dynamic and partial reconfiguration, SEU error detection and correction, and power management features described for the device family.

Typical Applications

• Wireless Infrastructure — Channel and switch card implementations in remote radio heads and mobile backhaul equipment where programmable logic and transceiver bandwidth are required.
• Wireline & Optical Networking — 40G/100G muxponders, transponders, and line cards that need high‑speed serial interfaces and hard IP for protocol support.
• Broadcast & Media Processing — Studio switches and professional audio/video processing systems leveraging on‑chip memory and DSP resources.
• Compute & Storage Acceleration — Flash cache, server acceleration, and cloud compute appliances that benefit from large logic fabric and embedded RAM.
• Medical & Defense Systems — Diagnostic imaging, radar, and secure communications applications that use configurable logic and high I/O counts for custom processing pipelines.

Unique Advantages

• High Logic Density: 570,000 logic elements enable complex, high‑parallelism designs without external FPGA partitioning.
• Large On‑Chip Memory: Over 42 million bits of embedded RAM reduce external memory dependence and improve data throughput for buffering and streaming tasks.
• Comprehensive I/O and Packaging: 492 I/Os in a 1152‑FCBGA (35×35) footprint provide a balance of high pin count and compact board area for dense system designs.
• Advanced Interface Support: Arria 10 family hard IP for PCIe and 10 Gbps Ethernet and low‑power serial transceivers simplify implementation of high‑speed links and protocol stacks.
• Power & Thermal Planning: Documented core voltage range of 870–980 mV and extended operating temperature (0 °C to 100 °C) support predictable power budgeting and thermal design.
• Family Ecosystem: Part of the Arria 10 device family, benefiting from device‑level features such as DSP blocks, PLLs, reconfiguration options, and device documentation for development and system integration.

Why Choose 10AX057H2F34E2LG?

The 10AX057H2F34E2LG delivers a balance of logic capacity, embedded memory, I/O density, and advanced interface support drawn from the Arria 10 GX device family. It is positioned for mid‑range, performance‑sensitive systems where on‑chip resources and high‑speed connectivity simplify system architecture and accelerate time to market.

Engineers designing communications, broadcast, compute acceleration, or imaging systems will find the part’s logic resources, memory capacity, and package options suitable for dense, feature‑rich implementations, while extended‑grade thermal and power specifications enable reliable operation across standard commercial deployment environments.

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