10AX057H2F34I1SG

IC FPGA 492 I/O 1152FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 42082304 570000 1152-BBGA, FCBGA

Quantity 998 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O492Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs217080Number of Logic Elements/Cells570000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits42082304

Overview of 10AX057H2F34I1SG – Intel Arria 10 GX FPGA, 1152‑FCBGA (35×35)

The 10AX057H2F34I1SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1152‑FCBGA (35×35) package. It provides a high-density programmable fabric with substantial on-chip memory and I/O to support mid-range, performance-sensitive applications.

Designed for industrial-grade deployments, this device combines a 20 nm FPGA architecture with up to 570,000 logic elements, 42,082,304 total RAM bits and 492 general-purpose I/Os, enabling complex signal processing, high-throughput interfacing and system integration within a surface-mount BGA package.

Key Features

  • Programmable Fabric — 570,000 logic elements for implementing large, performance-oriented digital designs.
  • On-Chip Memory — 42,082,304 total RAM bits to support buffering, FIFOs and embedded data storage without external memory for many functions.
  • High I/O Density — 492 I/Os to support wide parallel interfaces, board-level connectivity and diverse peripheral integration.
  • Package and Mounting — 1152‑FCBGA (35×35) package in a surface-mount form factor for compact board-level deployment.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C operation for use in temperature-challenging environments.
  • Supply Voltage — Core supply range 870 mV to 980 mV to align with system power budgeting and regulator designs.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing.
  • Arria 10 Series Capabilities — Series-level features include power-efficient 20 nm architecture, support for serial transceivers and hard IP such as PCIe Gen1/Gen2/Gen3, as described in the Arria 10 device documentation.

Typical Applications

  • Wireless Infrastructure — Channel processing and remote radio head interface functions that benefit from dense logic, abundant memory and high I/O counts.
  • Wireline Networking — Line cards, aggregation and mux/ponder modules where on-chip RAM and programmable fabric handle packet buffering and protocol processing.
  • Broadcast and Pro AV — Video transport, switching and format conversion leveraging large logic capacity and memory resources.
  • Compute and Storage Acceleration — Server acceleration tasks and cache/flash interface logic that require custom datapaths and significant on-chip storage.

Unique Advantages

  • High Logic Capacity: 570,000 logic elements enable implementation of complex algorithms and wide datapath architectures on a single device, reducing system BOM.
  • Substantial On‑Chip Memory: Over 42 million RAM bits provide internal buffering and state storage to minimize external memory dependence and latency.
  • Robust I/O Count: 492 I/Os support dense board-level interconnects and flexible interface options for multi-channel systems.
  • Industrial Reliability: −40 °C to 100 °C operating range and surface-mount BGA packaging support deployment in industrial environments.
  • Compact, High‑Density Packaging: 1152‑FCBGA (35×35) delivers board space savings while maintaining thermal and routing characteristics for complex designs.
  • Series-Level Integration: Arria 10 platform features such as low-power serial transceivers and PCIe hard IP (per Arria 10 documentation) help accelerate system integration and time-to-market.

Why Choose 10AX057H2F34I1SG?

The 10AX057H2F34I1SG positions itself as a high-capacity, industrial-grade FPGA for designers who need large programmable resources, significant on-chip memory and high I/O density in a compact package. Its 20 nm Arria 10 architecture and series-level features support power-sensitive, mid-range applications that require both performance and integration.

This part is suited for engineering teams developing networking, wireless, broadcast, compute-acceleration or industrial signal-processing systems that benefit from scalable logic, internal RAM and a broad I/O count, while leveraging the Arria 10 family feature set described in the device documentation.

Request a quote or submit an inquiry for part 10AX057H2F34I1SG to get pricing and availability information for your design needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up