10AX057H2F34I1HG

The 10AX057H2F34I1HG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 1152‑ball FCBGA package. It combines a high-density programmable fabric with abundant embedded memory, high I/O count, and support for advanced serial interfaces to address midrange, performance‑ and power‑sensitive designs.

Designed for diverse markets—from wireless and wireline networking to compute acceleration and broadcast—the device delivers large logic capacity, substantial on‑chip RAM, and broad I/O and package options to simplify system integration in industrial temperature applications.

Key Features

• Logic Capacity — 570,000 logic elements and 217,080 CLBs provide high-density programmable fabric for complex custom logic and packet processing.
• On‑Chip Memory — 42,082,304 total RAM bits of embedded memory support buffering, packet queues, and on‑chip data storage for low‑latency designs.
• I/O and Package — 492 user I/Os in a surface‑mount 1152‑FCBGA (35×35) package enable high pin‑count system interfaces and dense board layouts.
• Power Supply Range — Core voltage support from 870 mV to 980 mV to match system power rails and regulator designs.
• Industrial Temperature Range — Rated operation from −40 °C to 100 °C for deployment in industrial and demanding thermal environments.
• High‑Speed Serial and Protocol Support — Family overview documents indicate support for low‑power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, and 10 Gbps Ethernet/Interlaken signaling for high‑bandwidth links.
• DSP and Timing Resources — Variable‑precision DSP blocks and comprehensive clock networks with PLLs provide deterministic timing and hardware acceleration for signal processing tasks.
• Advanced Configuration and Reconfiguration — The device family includes support for dynamic and partial reconfiguration and enhanced configuration options to enable runtime flexibility.
• System Integration — Arria 10 device family documentation describes options for SoC integration with a Hard Processor System (HPS) and dedicated hard IP for common protocols to reduce external components.

Typical Applications

• Wireless Infrastructure — Channel and switch cards, remote radio head functions, and mobile backhaul leveraging high logic density and on‑chip memory for baseband and control processing.
• Wireline Networking — 40G/100G muxponders, line cards, and aggregation equipment that require high I/O density and serial transceiver capability for high‑speed links.
• Compute & Storage Acceleration — Server offload, flash caching, and cloud compute acceleration using abundant logic, DSP resources, and large embedded RAM.
• Broadcast and Professional AV — Studio switches, transport, and video processing where on‑chip memory and deterministic timing help meet low‑latency processing requirements.
• Medical & Military Systems — Diagnostic imaging, radar, and secure communications systems benefiting from the device’s industrial temperature range and flexible reconfiguration.

Unique Advantages

• High Logic Density: 570,000 logic elements enable implementation of complex algorithms and multi‑function systems within a single device.
• Large On‑Chip Memory: 42,082,304 RAM bits reduce reliance on external memory for buffering and accelerate data‑intensive tasks.
• Comprehensive I/O and Packaging: 492 I/Os in a 1152‑FCBGA (35×35) package supports dense board integration and multiple high‑speed interfaces.
• Industrial‑Grade Operation: −40 °C to 100 °C operating range supports deployment in thermally demanding environments.
• Integrated Protocol and Transceiver Support: Family features such as PCIe hard IP and low‑power serial transceivers simplify system design for high‑bandwidth connectivity.
• Flexible Configuration: Support for dynamic and partial reconfiguration enables in‑field updates and runtime adaptability for evolving applications.

Why Choose 10AX057H2F34I1HG?

The 10AX057H2F34I1HG Arria 10 GX FPGA positions itself for engineers needing a balance of high logic capacity, substantial embedded memory, and robust I/O in an industrial temperature‑rated package. Its combination of programmable fabric, DSP resources, and documented support for high‑speed serial interfaces makes it suitable for midrange applications that require performance and integration without excessive system complexity.

For design teams targeting wireless and wireline infrastructure, compute acceleration, broadcast, or industrial systems, this device offers a scalable platform with documented configuration, power‑management, and reconfiguration capabilities to support long‑term product roadmaps.

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