10AX090R3F40E2LG

IC FPGA 342 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 59234304 900000 1517-BBGA, FCBGA

Quantity 583 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O342Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090R3F40E2LG – Arria 10 GX FPGA, 900,000 logic elements

The 10AX090R3F40E2LG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1517‑FCBGA (40×40) package. It delivers a high-density programmable fabric with 900,000 logic elements and extensive embedded memory, designed for midrange, performance-sensitive applications.

Targeted markets include wireless, wireline, broadcast, computing and storage, medical, and military applications where a balance of performance and power efficiency is required. The device combines large on‑chip RAM, substantial I/O, and programmable transceiver and system resources to support complex digital designs.

Key Features

  • Logic Capacity — 900,000 logic elements to implement large, complex digital designs and custom logic functions.
  • Embedded Memory — 59,234,304 total RAM bits for on‑chip data buffering, frame storage, and intermediate data processing.
  • I/O Density — 342 user I/O pins to support wide parallel interfaces, memory buses, and high‑speed connectivity.
  • Package and Mounting — 1517‑FCBGA (40×40) package in a surface‑mount form factor for high‑density board integration.
  • Power Supply — Core supply range 870 mV to 930 mV, enabling precise power budgeting for system-level design.
  • Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in a broad set of commercial and ruggedized environments.
  • Arria 10 Series Architecture — Series-level features include variable-precision DSP blocks, embedded memory blocks, clock networks and PLLs, and support for high‑speed serial and protocol hard IP as described for Intel Arria 10 devices.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards, remote radio head processing, and mobile backhaul functions benefiting from programmable DSP and logic resources.
  • Wireline Networking — Line cards, muxponders, and transponders for 40G/100G networking and data aggregation using the device's high logic and I/O capacity.
  • Broadcast and Media — Studio switches, video and audio processing, and transport functions where on‑chip memory and logic accelerate real‑time media tasks.
  • Computing and Storage — Server acceleration, flash cache interfaces, and cloud computing tasks that leverage large embedded RAM and programmable logic for custom acceleration.
  • Medical and Military Systems — Diagnostic imaging, radar, and secure communications modules that require high logic density and extended‑grade operation.

Unique Advantages

  • High programmable capacity: 900,000 logic elements provide the scale needed for complex signal processing, packet processing, and custom hardware acceleration.
  • Substantial on‑chip memory: 59,234,304 RAM bits reduce reliance on external memory for many buffering and processing tasks, simplifying board design.
  • Robust I/O support: 342 I/O pins enable integration with wide parallel interfaces, multiple memory channels, and numerous peripheral connections.
  • Compact, production‑ready package: 1517‑FCBGA (40×40) surface‑mount package supports high‑density PCB layout for space‑constrained systems.
  • Designed for diverse markets: Series-level Arria 10 capabilities and the extended temperature grade make this device suitable for demanding midrange applications across industries.
  • Precise power window: Core voltage specification (870 mV–930 mV) enables predictable power design and system-level budgeting.

Why Choose 10AX090R3F40E2LG?

The 10AX090R3F40E2LG Arria 10 GX FPGA combines a large programmable fabric, extensive embedded RAM, and abundant I/O in a production FCBGA package to address midrange, performance‑sensitive applications. Its extended grade operating range and clearly specified power envelope make it a practical choice for designs that require both capacity and predictable system integration.

This device is well suited to engineering teams building wireless and wireline infrastructure, broadcast and media processing, server acceleration, and other applications listed in the Arria 10 family overview. The combination of logic density, on‑chip memory, and I/O flexibility supports scalable designs and long‑term deployment in demanding environments.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the 10AX090R3F40E2LG Arria 10 GX FPGA.

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