10AX090R3F40E2SG

IC FPGA 342 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 59234304 900000 1517-BBGA, FCBGA

Quantity 1,035 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O342Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090R3F40E2SG – Arria 10 GX FPGA, 900,000 logic elements, 1517‑FCBGA

The 10AX090R3F40E2SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1517‑ball FCBGA package, designed for midrange, high‑performance applications. It combines a large logic capacity and substantial embedded memory with I/O density and series-level transceiver and IP capabilities documented for the Arria 10 family.

Targeted at power‑sensitive, high‑performance use cases across communications, broadcast, computing and instrumentation, the device delivers a balance of integration and efficiency while operating within a voltage supply range of 870 mV to 930 mV and an operating temperature window of 0 °C to 100 °C.

Key Features

  • Logic Capacity  Includes 900,000 logic elements to implement complex digital functions and large custom logic designs.
  • Embedded Memory  Provides 59,234,304 total RAM bits of on‑chip memory for buffering, lookup tables and packet or data storage.
  • I/O Density  Offers 342 general‑purpose I/O pins to support broad peripheral and interface requirements.
  • Package and Mounting  Supplied in a 1517‑FCBGA (40×40) package; intended for surface‑mount PCB assembly.
  • Power Supply Range  Operates from 870 mV to 930 mV core voltage, enabling designs that require low‑voltage FPGA cores.
  • Thermal and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for commercial‑to‑extended environments.
  • RoHS Compliance  Manufactured in accordance with RoHS environmental requirements.
  • Arria 10 Series Capabilities  Series documentation for Arria 10 devices describes features such as variable‑precision DSP blocks, embedded memory blocks, PLL and clock network support, PCIe Gen1/Gen2/Gen3 hard IP, and high‑speed serial transceiver capabilities including support for 10 Gbps Ethernet and Interlaken.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where high logic density and transceiver support are needed.
  • Wireline and Optical Networking  Line cards, muxponders and transponders that require embedded memory for buffering and hard IP for PCIe and high‑speed Ethernet.
  • Broadcast and Media Processing  Studio switches, video transport and professional audio/video processing using on‑chip memory and DSP resources.
  • Computing and Storage Acceleration  Server acceleration, flash cache and cloud compute offload where logic capacity and integration reduce external components.
  • Imaging and Medical Systems  Diagnostic imaging and scanner control that benefit from large on‑chip memory and programmable logic for custom processing pipelines.

Unique Advantages

  • High logic density: 900,000 logic elements enable large, complex designs without immediate need for multiple FPGAs.
  • Substantial on‑chip memory: 59,234,304 RAM bits reduce dependence on external memory for latency‑sensitive buffering and lookup operations.
  • Flexible I/O: 342 I/O pins provide connectivity for diverse peripheral and interface requirements, simplifying board design.
  • Series-level connectivity and IP: Arria 10 documentation includes PCIe hard IP and high‑speed transceiver support suitable for 10 Gbps class links, enabling integration of common high‑speed interfaces.
  • Compact, surface‑mount package: 1517‑FCBGA (40×40) package balances pin count and board area for dense system integration.
  • Regulatory and temperature readiness: RoHS compliance and an extended 0 °C to 100 °C operating range support deployment in a range of commercial and extended environments.

Why Choose 10AX090R3F40E2SG?

The 10AX090R3F40E2SG positions itself as a high‑capacity Arria 10 GX FPGA option for designers who need a combination of large logic resources, significant embedded memory, and abundant I/O in a compact FCBGA package. Series capabilities documented for the Arria 10 family—such as DSP blocks, clocking infrastructure and hard IP for high‑speed interfaces—make it suitable for midrange, power‑sensitive applications across communications, media and compute acceleration.

Backed by Intel Arria 10 device documentation and ecosystem materials, the device provides a scalable platform for designs that require integration of custom logic, memory buffers and high‑speed connectivity while maintaining RoHS compliance and extended temperature operation.

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