10AX090R3F40I2LG

The 10AX090R3F40I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1517-ball FCBGA package. It is part of the Arria 10 device family, a 20 nm mid-range FPGA/SoC family targeted at high-performance, power-sensitive midrange applications.

This device combines substantial logic capacity, on-chip memory, and a high I/O count to address networking, broadcast, computing, and industrial applications that require large programmable logic fabrics and flexible interfacing.

Key Features

• Logic Capacity  900,000 logic elements (cells) for implementing large-scale programmable logic designs.
• Embedded Memory  Total on-chip RAM of 59,234,304 bits to support buffering, lookup tables, and local storage for complex algorithms.
• I/O Density  342 general-purpose I/Os to enable extensive external device interfacing and board-level connectivity.
• Package  1517-ball FCBGA package (supplier device package: 1517-FCBGA (40×40)) for high-density board integration.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power-rail requirements.
• Operating Temperature  Rated for −40 °C to 100 °C operation for use across a wide industrial temperature range.
• Grade and Mounting  Industrial-grade device with surface-mount package for standard PCB assembly processes.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and high I/O density enable flexible signal processing.
• Wireline Networking  40G/100G muxponders, transponders, and line cards that require substantial logic and on-chip memory for packet processing and aggregation functions.
• Broadcast and Media  Studio switches, video transport, and professional audio/video systems needing programmable datapaths and buffering.
• Computing and Storage  Server acceleration, flash cache, and cloud computing servers where significant logic and RAM capacity accelerate custom functions.
• Industrial and Medical Systems  Diagnostic imaging and control systems that benefit from the device’s logic capacity and industrial temperature rating.

Unique Advantages

• High programmable logic density: 900,000 logic elements let you consolidate complex functions into a single device, reducing board-level component count.
• Large embedded RAM: Nearly 59.3 million bits of on-chip RAM provide local storage for high-throughput buffering and algorithm state.
• Extensive I/O count: 342 I/Os simplify system partitioning and reduce the need for external expanders or additional interface chips.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Dense FCBGA packaging: 1517-ball FCBGA (40×40) balances high pin count with a compact footprint for space-constrained boards.
• Controlled core voltage range: 870–930 mV supply range aligns with system power designs and enables predictable core operation.

Why Choose 10AX090R3F40I2LG?

The 10AX090R3F40I2LG positions Intel’s Arria 10 GX architecture into a high-capacity FPGA with strong on-chip memory and extensive I/O, designed for midrange designs that need a balance of performance and power sensitivity. Its industrial temperature rating and FCBGA packaging make it suitable for demanding embedded and communications equipment.

Engineers building networking, broadcast, storage, or industrial systems will find the device’s combination of logic, memory, and I/O useful for consolidating functions, simplifying board design, and scaling complex FPGA-based implementations while relying on the Arria 10 family’s midrange FPGA capabilities.

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