5AGXMA5D4F27C5N

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 13284352 190000 672-BBGA, FCBGA

Quantity 873 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8962Number of Logic Elements/Cells190000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13284352

Overview of 5AGXMA5D4F27C5N – Arria V GX FPGA, 672‑BBGA (27×27)

The 5AGXMA5D4F27C5N is an Intel Arria V GX field‑programmable gate array (FPGA) in a 672‑ball BGA FCBGA package. It delivers a high density of programmable logic and on‑chip memory in a surface‑mount 27×27 672‑FBGA footprint for commercial‑grade embedded and system designs.

Designed for applications requiring substantial logic capacity, embedded memory and flexible I/O, this device is supported by a comprehensive Arria V datasheet covering electrical characteristics, switching performance, configuration and I/O timing.

Key Features

  • High logic density — 190,000 logic elements to implement complex digital functions and custom hardware acceleration.
  • Embedded memory — approximately 13.28 Mbits of on‑chip RAM for buffering, FIFOs and state storage.
  • I/O capacity — 336 user I/Os to interface with peripherals, memory and board‑level signals.
  • Package — 672‑BBGA (FCBGA) supplier device package 672‑FBGA (27×27) in a surface‑mount format for compact board designs.
  • Core voltage — specified supply range from 1.07 V to 1.13 V for core power planning.
  • Commercial grade temperature — rated for 0 °C to 85 °C operation.
  • Compliance — RoHS compliant.

Unique Advantages

  • Substantial programmable fabric: 190,000 logic elements enable the integration of large custom datapaths and control logic without external ASICs or multiple FPGAs.
  • Significant on‑chip RAM: Approximately 13.28 Mbits of embedded memory reduces external memory dependence for many buffering and storage tasks, simplifying system architecture.
  • Ample I/O count: 336 I/Os provide flexible board‑level connectivity for parallel buses, control signals and peripheral interfaces.
  • Compact BGA package: 672‑ball FCBGA (27×27) supports high‑density PCB routing while keeping board footprint controlled for space‑constrained systems.
  • Commercial temperature rating: 0 °C to 85 °C suits a wide range of general‑purpose electronic products and prototyping environments.
  • Well‑documented family: The Arria V datasheet set includes detailed electrical, switching, configuration and I/O timing specifications to support design and validation.

Why Choose 5AGXMA5D4F27C5N?

This Intel Arria V GX device combines a high count of logic elements, substantial embedded RAM and a large I/O complement in a compact 672‑ball FCBGA package, making it well suited for designs that need on‑board programmable logic density without expanding PCB area. Its commercial grade rating and RoHS compliance support standard product deployments and prototyping.

Engineers selecting 5AGXMA5D4F27C5N benefit from the Arria V family documentation and electrical characterization, enabling predictable integration of core power, I/O planning and configuration into their system designs.

Request a quote or submit an order request to check availability and lead times for 5AGXMA5D4F27C5N. Technical documentation is available in the Arria V device datasheet for detailed implementation and validation information.

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