5AGXMA5D4F27C5G

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 13284352 190000 672-BBGA, FCBGA

Quantity 167 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8962Number of Logic Elements/Cells190000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits13284352

Overview of 5AGXMA5D4F27C5G – Arria V GX FPGA, 190,000 Logic Elements, 672-BBGA FCBGA

The 5AGXMA5D4F27C5G is an Intel Arria V GX field programmable gate array (FPGA) supplied in a 672-BBGA FCBGA package. This commercial-grade device delivers large logic capacity and substantial on-chip memory while providing a high count of general-purpose I/O for complex system designs.

Key on-device resources include approximately 190,000 logic elements, 8,962 logic array blocks, approximately 12.7 Mbits of embedded memory, and 336 I/O pins. The device operates from a core supply range of 1.07 V to 1.13 V and is specified for 0 °C to 85 °C ambient operation.

Key Features

  • High Logic Density  Approximately 190,000 logic elements and 8,962 logic array blocks support large, complex FPGA implementations and system-level integration.
  • On‑Chip Memory  Approximately 12.7 Mbits of embedded RAM provides on-chip storage for buffering, packet processing, and algorithm acceleration.
  • I/O Capacity  336 dedicated I/O pins enable broad interfacing to external peripherals, memory, and high-speed logic domains.
  • Power and Voltage  Core voltage supply range of 1.07 V to 1.13 V supports stable core operation within specified limits.
  • Package and Mounting  672-BBGA, FCBGA package (supplier device package: 672-FBGA (27x27)) in a surface-mount form factor for dense board-level integration.
  • Commercial Grade  Specified for commercial operation with an ambient temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.
  • Arria V Family  Part of the Arria V device family (GX class), documented in Intel/Altera device datasheets covering electrical characteristics, switching characteristics, configuration, and I/O timing.

Unique Advantages

  • Large, Integrated Logic Fabric: The combination of ~190,000 logic elements and 8,962 logic array blocks enables implementation of complex state machines, datapaths, and custom accelerators on a single device.
  • Substantial Embedded Memory: Approximately 12.7 Mbits of on-chip RAM reduces reliance on external memory for intermediate buffering and performance-critical data paths.
  • High I/O Flexibility: 336 I/O pins allow flexible partitioning of signals across multiple interfaces and can simplify board-level routing for mixed-signal and multi-protocol systems.
  • Compact, Surface-Mount Package: The 672-BBGA FCBGA package enables dense PCB layouts while delivering the connectivity required for high-performance designs.
  • Commercial Operation Range: Specified electrical and thermal operating limits (1.07 V–1.13 V core supply and 0 °C–85 °C ambient) make the device suitable for mainstream commercial electronics.
  • Regulatory Compliance: RoHS compliance supports lead-free assembly and environmental requirements.

Why Choose 5AGXMA5D4F27C5G?

The 5AGXMA5D4F27C5G Arria V GX FPGA is positioned for designs that require significant logic resources, on-chip memory, and broad I/O capability within a commercial temperature envelope. Its combination of approximately 190,000 logic elements, roughly 12.7 Mbits of embedded RAM, and 336 I/O pins supports consolidation of complex functions onto a single FPGA to reduce system complexity.

Manufactured by Intel and delivered in a 672-BBGA FCBGA surface-mount package, this device is suited for product development and production in commercial applications where high-density programmable logic and RoHS compliance are required.

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