5AGXMA5D4F27I3N

The 5AGXMA5D4F27I3N is an Intel Arria V GX field-programmable gate array (FPGA) IC supplied in a 672-ball BGA (FCBGA) package. Designed as an industrial-grade device, it delivers a large logic fabric, substantial embedded memory, and a high I/O count for complex, integration-heavy designs.

Its core characteristics—190,000 logic elements, approximately 13.3 Mbits of embedded RAM, 336 I/O pins, and a tight core voltage range of 1.12–1.18 V—make it suitable for demanding industrial and embedded applications that require dense logic, significant on-chip memory, and robust thermal operating range.

Key Features

• High-capacity logic: 190,000 logic elements to implement large-scale custom logic, state machines, and datapaths.
• Embedded memory: Approximately 13.3 Mbits of on-chip RAM for buffering, FIFOs, and embedded storage.
• Rich I/O count: 336 I/O pins to support complex peripheral connectivity and system integration.
• Industrial-grade operation: Rated for an operating temperature range of −40 °C to 100 °C, suitable for industrial environments.
• Core power envelope: Core voltage supply specified between 1.12 V and 1.18 V for precise power delivery and predictable core behavior.
• Package and mounting: 672-BBGA FCBGA package (supplier package listed as 672-FBGA, 27×27) in a surface-mount form factor for high-density board designs.
• Standards compliance: RoHS compliant, supporting lead-free assembly and regulatory preferences.

Typical Applications

• Industrial control systems: Industrial-grade temperature range and large logic capacity enable real-time control, sequencing, and machine automation tasks.
• Embedded compute modules: High logic density and ~13.3 Mbits of embedded RAM support custom processing blocks and intermediate buffering in embedded platforms.
• I/O-intensive systems: 336 I/O pins and a compact 672-BBGA package allow dense peripheral interfacing in space-constrained, high-channel-count designs.

Unique Advantages

• Large programmable fabric: 190,000 logic elements provide headroom for complex custom logic and parallel processing implementations.
• Substantial on-chip memory: Approximately 13.3 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
• High integration density: 336 I/Os in a 672-ball FCBGA package enable compact, high-functionality board designs while maintaining ample routing resources.
• Industrial reliability: Specified −40 °C to 100 °C operating range and industrial grade designation support deployment in harsh environments.
• Tight core supply window: 1.12–1.18 V core voltage specification aids in predictable power budgeting and stable core operation.
• RoHS compliant: Supports lead-free manufacturing flows and environmental compliance requirements.

Why Choose 5AGXMA5D4F27I3N?

The 5AGXMA5D4F27I3N Arria V GX FPGA delivers a balanced combination of large logic capacity, significant embedded memory, and extensive I/O in a surface-mount 672-BBGA package, all packaged and rated for industrial operation. These attributes make it well suited for customers building high-density, reliability-focused systems that require substantial on-chip resources and a robust thermal operating envelope.

For engineers and procurement teams targeting scalable, integrated FPGA solutions, this device offers verifiable hardware parameters—logic element count, embedded memory capacity, I/O density, package details, supply voltage range, and operating temperature—that simplify system-level tradeoffs and BOM decisions.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and ordering information for the 5AGXMA5D4F27I3N Arria V GX FPGA.