5AGXMA5D4F27I3G

The 5AGXMA5D4F27I3G is an Arria V GX series FPGA supplied in a 672-ball FCBGA package. It delivers a densely integrated programmable fabric with 190,000 logic elements and approximately 13.3 Mbits of on-chip memory, making it suitable for industrial-grade embedded systems requiring considerable logic and memory resources.

With 336 general-purpose I/O, a 1.12 V–1.18 V core supply window, and an industrial operating range from −40 °C to 100 °C, this device is tailored for designs that require robust operating conditions and high I/O density in a surface-mount form factor.

Key Features

• Logic Capacity — 190,000 logic elements for consolidating multiple digital functions into a single programmable device.
• Logic Array Blocks — 8,962 logic array blocks for organized, scalable logic partitioning within the device architecture.
• Embedded Memory — Approximately 13.3 Mbits of on-chip RAM to support buffering, packet processing, and intermediate data storage without external memory.
• I/O Count — 336 I/O pins to enable broad peripheral connectivity and high channel density for system interfaces.
• Power and Voltage — Core supply rated from 1.12 V to 1.18 V, providing a defined power envelope for system power budgeting and regulator selection.
• Package & Mounting — 672-ball BGA in a supplier device package of 672-FBGA (27×27) supplied for surface-mount PCB assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for demanding thermal environments.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control — Leverage the industrial temperature rating and extensive I/O to implement motor control, PLC interfaces, and factory automation logic.
• High-density Logic Consolidation — Use the 190,000 logic elements and abundant on-chip RAM to combine multiple control and processing functions into a single FPGA.
• Networking & Interface Bridging — 336 I/O pins support dense port counts and complex protocol interfacing for networking equipment and communication gateways.

Unique Advantages

• Substantial On-chip Resources: The combination of 190,000 logic elements and ~13.3 Mbits of RAM reduces dependence on external logic and memory, simplifying BOM and PCB layout.
• High I/O Density: 336 I/Os enable multi-channel connectivity and flexible pin assignments for complex system interfaces.
• Industrial Reliability: Specified for −40 °C to 100 °C operation to meet the environmental needs of industrial deployments.
• Compact Surface-Mount Package: The 672-ball FCBGA package offers a high pin-count solution in a footprint suitable for modern PCB assembly processes.
• Predictable Power Envelope: A defined core voltage range (1.12 V–1.18 V) aids in regulator selection and thermal/power planning.
• Regulatory Compliance: RoHS compliance facilitates integration into lead‑free production environments.

Why Choose 5AGXMA5D4F27I3G?

This Arria V GX FPGA provides a balanced combination of large logic capacity, substantial embedded memory, and high I/O count in an industrial-grade, surface-mount package. It is suited for engineers and system designers aiming to consolidate complex digital functions, implement dense interface logic, or deploy programmable hardware in challenging temperature environments.

Backed by the Arria V device family specifications, the 5AGXMA5D4F27I3G offers a predictable hardware platform for scalable, long-life embedded designs where integration density, I/O flexibility, and industrial operating range are priorities.

Request a quote or submit an inquiry to receive pricing details, availability, and lead-time information for 5AGXMA5D4F27I3G. Our team can provide technical assistance and help evaluate this FPGA for your design requirements.