5AGXMA5D4F27C4G

The 5AGXMA5D4F27C4G is an Intel Arria V GX field-programmable gate array (FPGA) offered in a commercial-grade 672-BBGA (27×27) surface-mount package. The device provides a high logic capacity and substantial on-chip memory along with a large I/O count, suitable for complex, high-density FPGA implementations.

Key value propositions are its large logic element count, significant embedded RAM, and broad I/O availability combined with a narrow core supply voltage window and commercial operating temperature range—attributes that simplify system-level power and thermal planning for board-level designs.

Key Features

• Logic Capacity  Approximately 190,000 logic elements for implementing large-scale digital designs and custom logic functions.
• Embedded Memory  Approximately 13.28 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory in many use cases.
• I/O Density  336 user I/Os to accommodate extensive peripheral and bus interfacing requirements on a single device.
• Package & Mounting  672-ball BGA (FCBGA) in a 27×27 mm footprint, surface-mount mounting type for compact board integration.
• Power Supply  Core voltage supply specified at 1.07 V to 1.13 V to guide power delivery network design and ensure correct device operation.
• Commercial Grade & Temperature  Specified for commercial operation with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant to meet common environmental and assembly requirements.

Typical Applications

• High-density digital logic  Use the device’s approximately 190,000 logic elements to implement complex state machines, datapaths, and custom accelerators.
• On-chip buffering and data storage  Leverage the ~13.28 Mbits of embedded RAM for packet buffering, FIFOs, and local scratch memory in throughput-sensitive designs.
• Multi-interface boards  The 336 I/Os enable integration with multiple peripherals, parallel buses, and interface converters on a single FPGA.
• Compact board-level systems  The 672-BBGA (27×27) package supports high-density PCB layouts where board area and I/O count are priorities.

Unique Advantages

• Large available logic fabric  Delivers capacity for extensive custom logic implementation, reducing the need for multiple devices in many designs.
• Significant on-chip memory  Embedded RAM capacity enables local data handling and reduces dependency on external memory for many applications.
• High I/O count  336 user I/Os provide flexibility to connect to numerous sensors, interfaces, and board-level interconnects without multiplexing compromises.
• Compact BGA package  The 672-ball FCBGA (27×27) footprint allows dense routing and minimizes PCB area for space-constrained designs.
• Predictable power envelope  A clearly defined core voltage range (1.07 V–1.13 V) assists designers in selecting appropriate power delivery and decoupling strategies.
• Commercial-grade qualification  Specified operating range of 0 °C to 85 °C and RoHS compliance align with standard commercial product requirements.

Why Choose 5AGXMA5D4F27C4G?

The 5AGXMA5D4F27C4G combines a large logic element count, substantial embedded RAM, and extensive I/O in a compact 672-BBGA package, making it well suited for board-level designs that require high integration density and flexible interfacing. As a commercial-grade member of the Intel Arria V GX family, it provides a documented electrical and configuration specification set to support system-level design and validation.

This device is appropriate for engineering teams and procurement focused on scalable FPGA solutions that balance logic capacity, on-chip memory, and I/O availability while maintaining a controlled power and thermal profile for commercial-temperature applications.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the 5AGXMA5D4F27C4G FPGA.