5AGXMA3D6F27C6G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 336 11746304 156000 672-BBGA, FCBGA |
|---|---|
| Quantity | 4 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7362 | Number of Logic Elements/Cells | 156000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 11746304 |
Overview of 5AGXMA3D6F27C6G – Arria V GX FPGA, 156000 Logic Elements, 672-BBGA
The 5AGXMA3D6F27C6G is an Intel Arria V GX Field Programmable Gate Array (FPGA) IC offering a high-capacity programmable logic fabric. This device combines 156,000 logic elements, approximately 11.75 Mbits of on-chip RAM, and 336 general-purpose I/O to address designs that require dense logic, substantial embedded memory, and broad I/O connectivity.
Packaged in a 672-ball BGA (FCBGA) with a supplier-defined 672-FBGA (27×27) outline and specified as commercial grade, the device is RoHS compliant and operates across a 1.07–1.13 V core supply window and a 0 °C to 85 °C temperature range.
Key Features
- FPGA Capacity — 156,000 logic elements for implementing complex programmable logic and custom datapaths.
- Embedded Memory — Approximately 11.75 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
- I/O Resources — 336 I/O pins providing extensive external interfacing capability for peripherals and board-level connectivity.
- Power Supply — Core operating voltage range of 1.07–1.13 V to match platform power requirements.
- Package & Mounting — 672-BBGA FCBGA package; supplier device package listed as 672-FBGA (27×27). Surface-mount package suited for compact board implementations.
- Operating Range — Commercial grade device rated for 0 °C to 85 °C operation.
- Compliance — RoHS compliant for environmental and regulatory considerations.
Unique Advantages
- High logic density: 156,000 logic elements enable implementation of sizeable custom logic and hardware acceleration in a single device.
- Substantial embedded memory: Approximately 11.75 Mbits of RAM reduces dependence on external memory for many buffering and caching tasks.
- Extensive I/O connectivity: 336 I/O supports complex interfacing requirements without immediate need for external I/O expanders.
- Compact surface-mount package: 672-ball FCBGA (27×27) provides a high-pin-count footprint in a board-friendly BGA format.
- Defined power envelope: Narrow core supply range of 1.07–1.13 V simplifies power delivery design and voltage regulation selection.
- Commercial-grade qualification: Rated for 0 °C to 85 °C operation and RoHS compliance for broad deployment in commercial systems.
Why Choose 5AGXMA3D6F27C6G?
The 5AGXMA3D6F27C6G Arria V GX FPGA delivers a balance of high logic capacity, on-chip memory, and extensive I/O in a commercial-grade, RoHS-compliant package. Its specified core voltage range and 672-ball BGA footprint make it suitable for compact, performance-oriented board designs that require significant programmable logic and local RAM.
This device is appropriate for engineering teams and procurement seeking a verified Arria V GX FPGA option with explicit electrical and mechanical specifications to support detailed design, power budgeting, and thermal planning.
If you would like pricing or availability information, request a quote or submit a quote inquiry for 5AGXMA3D6F27C6G today.

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