5AGXMA3D6F27C6G

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 11746304 156000 672-BBGA, FCBGA

Quantity 4 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXMA3D6F27C6G – Arria V GX FPGA, 156000 Logic Elements, 672-BBGA

The 5AGXMA3D6F27C6G is an Intel Arria V GX Field Programmable Gate Array (FPGA) IC offering a high-capacity programmable logic fabric. This device combines 156,000 logic elements, approximately 11.75 Mbits of on-chip RAM, and 336 general-purpose I/O to address designs that require dense logic, substantial embedded memory, and broad I/O connectivity.

Packaged in a 672-ball BGA (FCBGA) with a supplier-defined 672-FBGA (27×27) outline and specified as commercial grade, the device is RoHS compliant and operates across a 1.07–1.13 V core supply window and a 0 °C to 85 °C temperature range.

Key Features

  • FPGA Capacity — 156,000 logic elements for implementing complex programmable logic and custom datapaths.
  • Embedded Memory — Approximately 11.75 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
  • I/O Resources — 336 I/O pins providing extensive external interfacing capability for peripherals and board-level connectivity.
  • Power Supply — Core operating voltage range of 1.07–1.13 V to match platform power requirements.
  • Package & Mounting — 672-BBGA FCBGA package; supplier device package listed as 672-FBGA (27×27). Surface-mount package suited for compact board implementations.
  • Operating Range — Commercial grade device rated for 0 °C to 85 °C operation.
  • Compliance — RoHS compliant for environmental and regulatory considerations.

Unique Advantages

  • High logic density: 156,000 logic elements enable implementation of sizeable custom logic and hardware acceleration in a single device.
  • Substantial embedded memory: Approximately 11.75 Mbits of RAM reduces dependence on external memory for many buffering and caching tasks.
  • Extensive I/O connectivity: 336 I/O supports complex interfacing requirements without immediate need for external I/O expanders.
  • Compact surface-mount package: 672-ball FCBGA (27×27) provides a high-pin-count footprint in a board-friendly BGA format.
  • Defined power envelope: Narrow core supply range of 1.07–1.13 V simplifies power delivery design and voltage regulation selection.
  • Commercial-grade qualification: Rated for 0 °C to 85 °C operation and RoHS compliance for broad deployment in commercial systems.

Why Choose 5AGXMA3D6F27C6G?

The 5AGXMA3D6F27C6G Arria V GX FPGA delivers a balance of high logic capacity, on-chip memory, and extensive I/O in a commercial-grade, RoHS-compliant package. Its specified core voltage range and 672-ball BGA footprint make it suitable for compact, performance-oriented board designs that require significant programmable logic and local RAM.

This device is appropriate for engineering teams and procurement seeking a verified Arria V GX FPGA option with explicit electrical and mechanical specifications to support detailed design, power budgeting, and thermal planning.

If you would like pricing or availability information, request a quote or submit a quote inquiry for 5AGXMA3D6F27C6G today.

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