5AGXMA3D4F31I5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 416 11746304 156000 896-BBGA, FCBGA |
|---|---|
| Quantity | 1,515 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 416 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7362 | Number of Logic Elements/Cells | 156000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 11746304 |
Overview of 5AGXMA3D4F31I5N – Arria V GX Field Programmable Gate Array (FPGA) IC 416 11746304 156000 896-BBGA, FCBGA
The 5AGXMA3D4F31I5N is an Intel Arria V GX Field Programmable Gate Array (FPGA) offered in an industrial grade. It provides a high-density programmable logic fabric with a defined core voltage range and broad operating temperature, designed for systems that require configurable logic, on-chip memory, and large I/O counts.
Targeted at industrial applications and embedded designs, this Arria V GX device combines substantial logic capacity, embedded RAM, and a high pin-count FCBGA package to support complex, high-channel-count implementations.
Key Features
- Logic Capacity — 156,000 logic elements to implement complex custom logic and control functions.
- Configurable Logic Blocks — Device-level architecture supports large programmable designs with significant routing and fabric resources.
- Embedded Memory — Approximately 11.7 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
- I/O Density — 416 user I/O pins enabling high-channel-count interfaces and parallel connectivity.
- Powering — Core supply voltage specified between 1.07 V and 1.13 V for stable core operation.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
- Package & Mounting — 896-ball FCBGA (896-BBGA, supplier package 896-FBGA 31×31) in a surface-mount form factor for compact, high-density board designs.
- RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Industrial Control & Automation — Use the programmable logic and wide temperature range to implement custom control, sequencing, and deterministic processing in factory and process environments.
- High-Density I/O Systems — Leverage 416 I/O pins for multi-channel data acquisition, interface aggregation, and parallel sensor or actuator connectivity.
- Embedded Signal Processing — Combine large logic capacity and embedded RAM to implement buffering, real-time data paths, and custom signal processing pipelines.
- Platform Prototyping & Custom Hardware — Suitable for platform development where flexibility in logic partitioning and reprogrammability speed time-to-market for custom hardware solutions.
Unique Advantages
- High Logic Density: 156,000 logic elements enable substantial integration of control, datapath, and glue logic into a single device, reducing board-level complexity.
- Significant On-Chip Memory: Approximately 11.7 Mbits of embedded RAM supports large buffers, LUT-based functions, and state-heavy implementations without external memory.
- Large I/O Count: 416 I/Os provide the flexibility to interface with many peripherals or parallel channels directly from the FPGA fabric.
- Industrial Reliability: Rated for −40 °C to 100 °C operation to meet the environmental demands of industrial deployments.
- Compact, High-Pin-Count Package: The 896-ball FCBGA (31×31) package delivers high signal density in a surface-mount footprint suitable for modern PCB layouts.
- Tight Core Voltage Specification: A narrow 1.07 V–1.13 V supply range simplifies power-rail planning and ensures predictable core behavior.
Why Choose 5AGXMA3D4F31I5N?
The 5AGXMA3D4F31I5N Arria V GX FPGA balances substantial logic and embedded memory with a high I/O count and industrial-grade operating window, making it well suited for complex embedded and industrial designs that require configurable hardware. Its compact 896-ball FCBGA package facilitates dense board integration while maintaining a large number of user I/Os.
Backed by the Arria V device documentation, this device is appropriate for teams needing scalable programmable logic with clearly defined electrical and thermal parameters for robust deployment and long-term maintainability.
Request a quote or submit an inquiry for pricing and availability of the 5AGXMA3D4F31I5N Arria V GX FPGA to evaluate fit for your next project.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018