5AGXMA3D4F31I5N

IC FPGA 416 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 416 11746304 156000 896-BBGA, FCBGA

Quantity 1,515 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O416Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXMA3D4F31I5N – Arria V GX Field Programmable Gate Array (FPGA) IC 416 11746304 156000 896-BBGA, FCBGA

The 5AGXMA3D4F31I5N is an Intel Arria V GX Field Programmable Gate Array (FPGA) offered in an industrial grade. It provides a high-density programmable logic fabric with a defined core voltage range and broad operating temperature, designed for systems that require configurable logic, on-chip memory, and large I/O counts.

Targeted at industrial applications and embedded designs, this Arria V GX device combines substantial logic capacity, embedded RAM, and a high pin-count FCBGA package to support complex, high-channel-count implementations.

Key Features

  • Logic Capacity — 156,000 logic elements to implement complex custom logic and control functions.
  • Configurable Logic Blocks — Device-level architecture supports large programmable designs with significant routing and fabric resources.
  • Embedded Memory — Approximately 11.7 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
  • I/O Density — 416 user I/O pins enabling high-channel-count interfaces and parallel connectivity.
  • Powering — Core supply voltage specified between 1.07 V and 1.13 V for stable core operation.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
  • Package & Mounting — 896-ball FCBGA (896-BBGA, supplier package 896-FBGA 31×31) in a surface-mount form factor for compact, high-density board designs.
  • RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

  • Industrial Control & Automation — Use the programmable logic and wide temperature range to implement custom control, sequencing, and deterministic processing in factory and process environments.
  • High-Density I/O Systems — Leverage 416 I/O pins for multi-channel data acquisition, interface aggregation, and parallel sensor or actuator connectivity.
  • Embedded Signal Processing — Combine large logic capacity and embedded RAM to implement buffering, real-time data paths, and custom signal processing pipelines.
  • Platform Prototyping & Custom Hardware — Suitable for platform development where flexibility in logic partitioning and reprogrammability speed time-to-market for custom hardware solutions.

Unique Advantages

  • High Logic Density: 156,000 logic elements enable substantial integration of control, datapath, and glue logic into a single device, reducing board-level complexity.
  • Significant On-Chip Memory: Approximately 11.7 Mbits of embedded RAM supports large buffers, LUT-based functions, and state-heavy implementations without external memory.
  • Large I/O Count: 416 I/Os provide the flexibility to interface with many peripherals or parallel channels directly from the FPGA fabric.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to meet the environmental demands of industrial deployments.
  • Compact, High-Pin-Count Package: The 896-ball FCBGA (31×31) package delivers high signal density in a surface-mount footprint suitable for modern PCB layouts.
  • Tight Core Voltage Specification: A narrow 1.07 V–1.13 V supply range simplifies power-rail planning and ensures predictable core behavior.

Why Choose 5AGXMA3D4F31I5N?

The 5AGXMA3D4F31I5N Arria V GX FPGA balances substantial logic and embedded memory with a high I/O count and industrial-grade operating window, making it well suited for complex embedded and industrial designs that require configurable hardware. Its compact 896-ball FCBGA package facilitates dense board integration while maintaining a large number of user I/Os.

Backed by the Arria V device documentation, this device is appropriate for teams needing scalable programmable logic with clearly defined electrical and thermal parameters for robust deployment and long-term maintainability.

Request a quote or submit an inquiry for pricing and availability of the 5AGXMA3D4F31I5N Arria V GX FPGA to evaluate fit for your next project.

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