5AGXMA3D6F31C6G

The 5AGXMA3D6F31C6G is an Arria V GX FPGA in a 896-ball BGA (FCBGA) package, designed for commercial embedded designs that require substantial programmable logic, on-chip memory, and large I/O counts. This device provides 156,000 logic elements and approximately 11.7 Mbits of embedded RAM, with 416 user I/O pins, making it suitable for complex system integration and high-density digital designs.

Packaged in a 896-FBGA (31×31) format for surface-mount assembly, the device operates from a core supply range of 1.07 V to 1.13 V and is rated for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• High Logic Capacity — 156,000 logic elements provide substantial programmable fabric for complex logic and control implementations.
• Significant On-chip Memory — Approximately 11.7 Mbits of embedded RAM for data buffering, state storage, and on-chip packet or frame handling.
• Extensive I/O — 416 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and flexible board-level routing.
• Package and Mounting — 896-BBGA FCBGA package (supplier device package: 896-FBGA, 31×31) optimized for surface-mount PCB assembly.
• Power and Supply — Core supply operating range of 1.07 V to 1.13 V for predictable power domain design.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation to match a wide range of commercial applications.
• Regulatory — RoHS compliant for modern electronics manufacturing requirements.

Typical Applications

• High-density digital processing — Implement large custom datapaths and control logic where 156,000 logic elements and extensive embedded RAM accelerate on-chip processing.
• Multi-interface bridging — Use the 416 I/O pins to consolidate and translate between numerous parallel and serial interfaces on a single device.
• Embedded system control — Centralize glue logic, timing, and peripheral management in compact, surface-mount board designs using the 896-FBGA package.
• Prototyping and FPGA-based acceleration — Provide programmable hardware resources for design validation and proof-of-concept implementations in commercial product development.

Unique Advantages

• Substantial on-chip logic: 156,000 logic elements enable complex state machines, parallel processing, and integration of multiple functions into a single device.
• Ample embedded RAM: Approximately 11.7 Mbits of on-chip memory reduces reliance on external RAM for temporary data storage and buffering.
• High I/O density: 416 I/O pins allow broad system connectivity and flexible board-level partitioning without additional I/O expanders.
• Surface-mount, high-pin-count package: The 896-FBGA (31×31) package supports compact PCB layouts while providing many signals for complex designs.
• Commercial operation and compliance: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance simplify integration into consumer and industrial electronics supply chains.

Why Choose 5AGXMA3D6F31C6G?

This Arria V GX FPGA balances high programmable logic density, on-chip memory, and extensive I/O in a single, surface-mount 896-FBGA package. Its electrical operating range and commercial temperature rating make it suitable for a wide range of commercial embedded systems that require significant logic resources and on-board memory without external component proliferation.

Designers seeking a scalable, high-density FPGA for integration-focused projects will appreciate the combination of 156,000 logic elements, approximately 11.7 Mbits of embedded RAM, and 416 I/O pins. The device’s package and supply characteristics support compact, manufacturable designs with RoHS compliance for modern production requirements.

Request a quote or submit a procurement inquiry to evaluate the 5AGXMA3D6F31C6G for your next design and receive pricing and availability details.