5AGXMA3D6F27C6N

The 5AGXMA3D6F27C6N is an Arria V GX Field Programmable Gate Array (FPGA) in a commercial-grade offering. It delivers a large programmable fabric with 156,000 logic elements and approximately 11.75 Mbits of embedded RAM, making it suitable for demanding commercial FPGA designs that require high I/O density and on-chip memory.

Packaged in a 672-ball FBGA (27×27) / 672‑BBGA FCBGA, the device supports a 1.07 V to 1.13 V core supply and operates across a commercial temperature range of 0 °C to 85 °C, enabling deployment in standard commercial environments.

Key Features

• Core Capacity  156,000 logic elements provide extensive programmable resources for complex custom logic and parallel processing.
• Embedded Memory  Approximately 11.75 Mbits of on-chip RAM to support buffering, LUT-based storage, and memory-hungry logic functions.
• I/O Density  336 I/Os for broad connectivity to peripherals, interfaces, and external devices.
• Package Options  672‑BBGA (FCBGA) with supplier device package 672‑FBGA (27×27) for high-pin-count board designs and compact footprint.
• Power Supply  Core voltage specified from 1.07 V to 1.13 V for deterministic supply planning and power budgeting.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C to match typical commercial application environments.
• Standards Compliance  RoHS compliant for regulatory and manufacturing process alignment.

Typical Applications

• Custom Logic and Prototyping  High logic capacity and embedded RAM make this FPGA suitable for custom digital designs and rapid prototyping in commercial projects.
• High‑Density I/O Systems  336 I/Os support designs that require numerous external interfaces or complex board-level interconnects.
• Memory‑Intensive Processing  On‑chip memory (approximately 11.75 Mbits) supports buffering and intermediate data storage for signal processing or data aggregation tasks.

Unique Advantages

• Large Programmable Fabric: 156,000 logic elements provide headroom for complex logic, state machines, and parallel datapaths.
• Substantial Embedded Memory: Approximately 11.75 Mbits of RAM reduces reliance on external memory for many buffering and storage needs.
• High I/O Count: 336 I/Os enable broad peripheral connectivity without resorting to external I/O expanders.
• Commercial Temperature and RoHS Compliance: Operation from 0 °C to 85 °C and RoHS compliance support standard commercial production and assembly flows.
• High‑Pin FBGA Package: 672‑FBGA (27×27) package simplifies board routing for high‑density designs while maintaining a compact profile.

Why Choose 5AGXMA3D6F27C6N?

The 5AGXMA3D6F27C6N Arria V GX FPGA combines a large logic element count with significant on‑chip RAM and a high I/O count in a compact 672‑ball FBGA package. Its commercial-grade temperature rating and defined core voltage range make it straightforward to specify into mainstream commercial designs that need substantial programmable resources and connectivity.

This device is well suited for engineering teams building advanced commercial FPGA solutions where integration of logic, embedded memory, and high-density I/O are priorities. The Arria V GX configuration provides a clear, verifiable specification set for power, temperature, and packaging to support reliable development and production planning.

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