5AGXMA3D4F31I5G

The 5AGXMA3D4F31I5G is an Intel Arria V GX field-programmable gate array (FPGA) offered in an industrial grade package. It provides a high-density programmable fabric with abundant I/O and on-chip memory for custom digital logic, signal processing, and system integration tasks.

Designed for deployment in environments requiring extended temperature range and reliable surface-mount packaging, this device balances logic capacity, embedded memory, and I/O density for demanding embedded and industrial applications.

Key Features

• Logic Capacity  Approximately 156,000 logic elements to implement complex custom digital designs and hardware acceleration.
• Embedded Memory  Approximately 11.7 Mbits of on‑chip RAM to support buffering, packet processing, and LUT-based storage.
• I/O Density  416 user I/O pins to support multiple parallel interfaces and high pin-count system integration.
• Package  896‑BBGA (FCBGA) supplier package 896‑FBGA (31×31) in a surface‑mount form factor for compact board layouts.
• Power Supply  Core operating voltage range from 1.07 V to 1.13 V to align with system power rails and regulator designs.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for use in extended-temperature environments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.
• Industrial Grade  Specified as an industrial‑grade device for deployments that require broader environmental tolerance.

Typical Applications

• Industrial control and automation  Industrial grade temperature range and surface‑mount packaging make the device suitable for motor control, factory automation gateways, and process-control logic implementations.
• Embedded hardware acceleration  Large logic capacity and on‑chip RAM enable implementation of custom accelerators and datapath pipelines for compute‑intensive tasks.
• High‑density I/O systems  With 416 I/O pins and a compact 896‑BBGA footprint, the device fits applications that require multiple parallel interfaces or complex board routing.
• System integration and prototyping  Programmable fabric and abundant resources allow integration of custom peripherals, glue logic, and system-level functions into a single device.

Unique Advantages

• High logic and memory integration: Combine roughly 156,000 logic elements with ~11.7 Mbits of embedded RAM to consolidate functions that would otherwise require multiple discrete devices.
• Dense I/O for versatile interfacing: 416 I/O pins allow direct connection to multiple buses, sensors, and peripherals without extensive board-level multiplexing.
• Compact, production‑ready package: 896‑BBGA (31×31) surface‑mount package provides a space‑efficient footprint for high-density PCBs.
• Industrial operating range: Specified −40 °C to 100 °C supports deployments in harsher environments where extended temperature tolerance is required.
• Controlled core power window: Narrow core voltage range (1.07 V–1.13 V) simplifies power rail design and regulator selection for stable operation.
• Compliance ready: RoHS compliance aligns with common environmental and manufacturing requirements.

Why Choose 5AGXMA3D4F31I5G?

The 5AGXMA3D4F31I5G Arria V GX FPGA combines substantial logic capacity, embedded memory, and high I/O count in a compact industrial‑grade FCBGA package. It is well suited for engineers and system designers who need a programmable, high‑density solution that supports extended temperature operation and robust board integration.

As part of the Arria V device family, this FPGA is accompanied by published device documentation and electrical specifications to support system design, power budgeting, and thermal planning—enabling scalable development and long‑term deployment in industrial and embedded applications.

Request a quote or submit an inquiry to discuss availability, pricing, and board‑level design considerations for the 5AGXMA3D4F31I5G Arria V GX FPGA.