5AGXMA3D4F31I3N

The 5AGXMA3D4F31I3N is an Intel Arria V GX family FPGA offered in an industrial-grade FCBGA package. It provides a large logic fabric and on-chip memory capacity suitable for complex, embedded logic implementations and system integration in industrial environments.

This device combines a dense logic element count with extensive I/O and a controlled supply range, enabling designers to implement high-channel-count logic, memory buffering, and system-level interfacing while operating across a wide industrial temperature range.

Key Features

• Logic Capacity — 156,000 logic elements and 7,362 logic blocks for implementing complex digital functions and state machines.
• Embedded Memory — Approximately 11.75 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• I/O Density — 416 general-purpose I/O pins to accommodate broad peripheral, sensor, and interface requirements.
• Package and Mounting — 896-BBGA, FCBGA package (supplier package: 896-FBGA (31x31)); surface-mount construction for standard PCB assembly.
• Power Supply — Core voltage specified between 1.12 V and 1.18 V for predictable power budgeting and supply planning.
• Industrial Grade and Temperature Range — Rated for industrial operation with an operating temperature range from −40 °C to 100 °C.
• Regulatory — RoHS compliant.

Unique Advantages

• High logic integration: 156,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip RAM: Approximately 11.75 Mbits of embedded memory reduces dependence on external memory for mid-sized buffering needs.
• Large I/O complement: 416 I/Os support extensive peripheral connectivity and parallel interfacing without external expanders.
• Industrial robustness: Specified −40 °C to 100 °C operation aligns with demanding industrial temperature profiles.
• Predictable power envelope: A narrow core voltage range (1.12 V–1.18 V) simplifies power-supply design and margining.
• Surface-mount FCBGA package: 896-ball FCBGA footprint provides a compact, manufacturable package for high-density board layouts.

Why Choose 5AGXMA3D4F31I3N?

The 5AGXMA3D4F31I3N positions itself as a robust, industrial-grade FPGA option within the Arria V GX family, delivering a substantial logic element count, multi-megabit embedded memory, and a high I/O count in a single, surface-mount FCBGA package. Its specified operating temperature range and RoHS compliance make it suitable for industrial systems that require long-term reliability and regulatory alignment.

This device is appropriate for designs that need a balance of logic density, on-chip memory, and I/O capacity while maintaining a controlled core-voltage requirement. For engineers evaluating system-level consolidation and predictable thermal/power performance, the 5AGXMA3D4F31I3N offers a clearly specified hardware platform supported by the Arria V device documentation.

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