5AGXMA3D4F31I3G

The 5AGXMA3D4F31I3G is an Arria V GX field programmable gate array (FPGA) supplied in a 896-BBGA FCBGA package. It provides a substantial logic capacity with 156,000 logic elements, approximately 11.75 Mbits of embedded RAM, and 416 user I/O pins for complex, highly configurable digital designs.

Designed for industrial-grade operation, this device supports a core supply range of 1.12 V–1.18 V and an operating temperature range of −40 °C to 100 °C, making it suitable for applications that require extended thermal tolerance and high logic density in a surface-mount form factor.

Key Features

• Logic Capacity  Approximately 156,000 logic elements for implementing large, custom digital architectures and complex control logic.
• Embedded Memory  Approximately 11.75 Mbits of on-chip RAM to support buffering, state machines, and data storage without immediate reliance on external memory.
• I/O Density  416 user I/O pins to interface with peripherals, sensors, and high-pin-count subsystems.
• Package  896-BBGA, FCBGA package; supplier device package listed as 896-FBGA (31 × 31) for compact, high-pin-count surface-mount deployment.
• Power  Core supply voltage range specified at 1.12 V–1.18 V for predictable power budgeting and core-level integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to accommodate thermal requirements in industrial environments.
• Mounting Type  Surface mount package suitable for automated PCB assembly.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Designs that require on-board implementation of large digital functions, leveraging approximately 156,000 logic elements and abundant I/O.
• Memory-heavy designs  Configurations that benefit from approximately 11.75 Mbits of embedded RAM for buffering, FIFOs, and on-chip data storage.
• Industrial control and automation  Systems operating across −40 °C to 100 °C where industrial-grade temperature tolerance and surface-mount integration are required.

Unique Advantages

• High integration density: The large logic-element count supports consolidation of multiple functions into a single FPGA, reducing design complexity.
• Substantial on-chip memory: Approximately 11.75 Mbits of embedded RAM enables internal data buffering and state retention without immediate external memory dependencies.
• Extensive I/O resources: 416 I/O pins give designers flexibility for parallel interfaces, multi-channel data paths, and broad peripheral connectivity.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C addresses thermal requirements for industrial deployments.
• Compact, high-pin-count package: The 896-BBGA (896-FBGA, 31 × 31) form factor provides high connectivity in a surface-mount footprint suitable for automated assembly.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory considerations.

Why Choose 5AGXMA3D4F31I3G?

The 5AGXMA3D4F31I3G Arria V GX FPGA combines a high logic element count, significant embedded memory, and extensive I/O in a compact 896-BBGA FCBGA package rated for industrial temperature ranges. Its defined core voltage window (1.12 V–1.18 V) and surface-mount package make it straightforward to integrate into designs that demand predictable power and dense interconnects.

This device suits engineers and procurement teams targeting scalable, logic-dense FPGA solutions for industrial and complex digital designs where on-chip resources, thermal tolerance, and a compact high-pin-count package are priorities.

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