5AGXMA3D4F31C4N

IC FPGA 416 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 416 11746304 156000 896-BBGA, FCBGA

Quantity 1,145 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O416Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7362Number of Logic Elements/Cells156000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11746304

Overview of 5AGXMA3D4F31C4N – Arria V GX Field Programmable Gate Array (FPGA), 156000 logic elements

The 5AGXMA3D4F31C4N is an Arria V GX family Field Programmable Gate Array (FPGA) provided in a 896-BBGA FCBGA package. It delivers 156,000 logic elements, approximately 11.7 Mbits of embedded RAM, and a high I/O count for complex, programmable digital designs.

Targeted at commercial-grade applications, this device combines high-density programmable logic, substantial on-chip memory, and a broad I/O complement to support designs that require flexible, reconfigurable hardware with well-documented electrical and configuration specifications.

Key Features

  • Logic Density  156,000 logic elements to implement complex custom logic, finite-state machines, and datapaths.
  • Embedded Memory  Approximately 11.7 Mbits of on-chip RAM suitable for buffering, FIFOs, and local storage.
  • High I/O Count  416 general-purpose I/O pins to support wide parallel interfaces, peripherals, and complex board-level connectivity.
  • Package & Mounting  896-BBGA (FCBGA) package in a 31 × 31 supplier device footprint; surface-mount mounting for compact board designs.
  • Power Supply  Core voltage supply range of 1.07 V to 1.13 V, enabling tight power budgeting and predictable core operation.
  • Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS-compliant for environmental and manufacturing considerations.
  • Comprehensive Documentation  Detailed datasheet coverage includes electrical characteristics, switching characteristics, configuration specifications, and I/O timing for design validation and integration.

Typical Applications

  • High-density digital processing  Implement custom datapaths, state machines, and parallel processing logic where 156,000 logic elements are required.
  • Memory-buffered interfaces  Use embedded RAM (≈11.7 Mbits) for buffering, packet storage, and latency-sensitive dataflows.
  • Multi-interface boards  Leverage 416 I/Os for complex peripheral connectivity, wide buses, and mixed-signal front-ends.

Unique Advantages

  • Substantial logic capacity: Enables implementation of sizeable custom logic blocks and integration of multiple functions into a single device, reducing system complexity.
  • On-chip memory for local storage: Approximately 11.7 Mbits of RAM minimizes external memory dependence for many buffering and temporary storage needs.
  • High I/O density: 416 I/Os allow flexible board-level partitioning and support for parallel interfaces without additional I/O expanders.
  • Compact FCBGA package: The 896-BBGA (31×31) footprint delivers high pin count in a compact surface-mount form factor for dense PCB layouts.
  • Predictable power domain: Narrow core voltage range (1.07 V–1.13 V) simplifies core power supply design and regulation.
  • Documented design guidance: Datasheet coverage of electrical, switching, and configuration specifications supports thorough design validation and reliable integration.

Why Choose 5AGXMA3D4F31C4N?

The 5AGXMA3D4F31C4N Arria V GX FPGA delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact FCBGA package for commercial-grade applications. Its documented electrical and configuration specifications make it suitable for projects that demand repeatable performance and clear integration requirements.

Engineers designing complex digital systems, memory-buffered interfaces, or multi-I/O boards will find this device appropriate where on-chip resources and a high pin count reduce external components and simplify board-level architecture.

Request a quote or submit a parts inquiry to obtain availability and pricing details for the 5AGXMA3D4F31C4N.

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