5AGXMA3D4F27I3N

The 5AGXMA3D4F27I3N is an Intel Arria V GX Field Programmable Gate Array (FPGA) in a 672‑FBGA (27×27) surface‑mount package. It provides a large programmable fabric with 156,000 logic elements and approximately 11.75 Mbits of embedded memory, together with 336 general‑purpose I/Os.

Targeted for industrial‑grade applications, this device operates from a core supply of 1.12 V to 1.18 V and across an operating temperature range of –40 °C to 100 °C, delivering a combination of high integration, substantial on‑chip memory, and broad I/O for complex system designs.

Key Features

• Programmable Core  156,000 logic elements for implementing large, customizable logic functions and complex state machines.
• Embedded Memory  Approximately 11.75 Mbits of on‑chip RAM (11,746,304 bits) enabling local buffering, FIFOs, and memory‑intensive logic.
• I/O Connectivity  336 user I/Os to support wide peripheral interfacing and system integration without immediate external logic.
• Power  Specified core voltage range of 1.12 V to 1.18 V for core supply planning and power budgeting.
• Package & Mounting  672‑FBGA (27×27) surface‑mount package (672‑BBGA, FCBGA) suitable for compact board layouts and high‑density designs.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, appropriate for a wide range of industrial environments.
• Compliance  RoHS‑compliant to support environmental and regulatory requirements.

Typical Applications

• Industrial Control Systems  Use the industrial temperature rating, extensive I/O, and large logic capacity to implement deterministic control, protocol bridging, and system coordination functions.
• High‑Density Logic & Signal Processing  Leverage 156,000 logic elements and ~11.75 Mbits of embedded memory for implementing complex signal processing pipelines, custom accelerators, and buffering stages.
• Communication Interfaces  The large I/O count supports multi‑lane interfaces and flexible peripheral connectivity for data aggregation and protocol conversion tasks.

Unique Advantages

• Substantial Programmable Capacity: 156,000 logic elements enable significant on‑chip logic integration, reducing the need for additional external programmable devices.
• Meaningful On‑Chip Memory: Approximately 11.75 Mbits of embedded RAM supports local storage for buffers, lookup tables, and state retention without external memory.
• Broad I/O Count: 336 I/Os allow direct interfacing to a wide variety of peripherals and sensors, simplifying system design and lowering BOM complexity.
• Industrial Readiness: Operation from –40 °C to 100 °C and defined core voltage range support deployment in demanding industrial environments.
• Compact, Surface‑Mount Packaging: The 672‑FBGA (27×27) package provides high pin density for rich connectivity while keeping board footprint manageable.
• Regulatory Compliance: RoHS compliance aids in meeting environmental and manufacturing requirements.

Why Choose 5AGXMA3D4F27I3N?

The 5AGXMA3D4F27I3N Arria V GX FPGA combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact 672‑FBGA package, making it suitable for industrial systems that require extensive programmable logic and flexible interfacing. Its defined core voltage range and wide operating temperature window simplify integration into rugged designs demanding reliable operation.

Backed by Intel’s Arria V device family documentation and engineering support, this device is appropriate for system designers who need scalable programmable resources with strong on‑chip memory and I/O capabilities for long‑lifecycle industrial applications.

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