5AGXMA3D4F27I5G

The 5AGXMA3D4F27I5G is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 672‑ball FCBGA (27×27) package for surface‑mount assembly. This industrial‑grade device delivers a large logic fabric and on‑chip memory with a substantial I/O complement for complex system designs.

With 156,000 logic elements, approximately 11.75 Mbits of embedded memory and 336 I/Os, the device targets applications that require dense programmable logic, abundant on‑chip RAM, and extensive external interfacing while operating across an industrial temperature range.

Key Features

• Logic Capacity — 156,000 logic elements to implement large, complex digital designs and custom accelerators.
• Embedded Memory — Approximately 11.75 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage without external memory.
• I/O Density — 336 general‑purpose I/Os for broad connectivity to sensors, peripherals, and high‑speed interfaces.
• Package — 672‑BBGA, FCBGA (27×27) surface‑mount package for compact board integration and high pin count routing.
• Industrial Grade and Thermal Range — Rated for industrial operation with an operating temperature range of −40 °C to 100 °C for reliable field use.
• Power Supply — Core voltage specification range of 1.07 V to 1.13 V to guide power‑delivery design.
• Compliance — RoHS compliant to support restrictive substance requirements in manufacturing.

Typical Applications

• High‑Performance Signal Processing — Use the 156,000 logic elements and substantial on‑chip RAM for real‑time DSP pipelines, packet processing, and data path acceleration.
• Communications and Networking — 336 I/Os and the Arria V GX architecture suit protocol bridging, interface aggregation, and hardware offload tasks.
• Industrial Control and Automation — Industrial temperature rating and robust packaging make this FPGA appropriate for motor control, machine vision front ends, and industrial protocol handling.
• Prototyping and Custom ASIC Offload — Large logic capacity and embedded memory enable system prototyping or implementation of application‑specific logic blocks that reduce system latency.

Unique Advantages

• High Logic Density: 156,000 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing board complexity.
• Substantial On‑Chip RAM: Approximately 11.75 Mbits of embedded memory minimizes dependence on external DRAM for many buffering and temporary storage needs.
• Extensive I/O Count: 336 I/Os enable flexible system partitioning and interface variety without additional I/O expanders.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in factory, outdoor, and other demanding environments.
• Compact High‑Pin Package: 672‑BBGA (27×27) offers a high pin count in a compact footprint for dense system designs.
• Regulatory Compliance: RoHS compliance assists in meeting environmental and manufacturing requirements.

Why Choose 5AGXMA3D4F27I5G?

The 5AGXMA3D4F27I5G Arria V GX FPGA combines a large logic fabric, significant on‑chip memory, and a high I/O count within an industrial‑rated, compact FCBGA package—making it a practical choice for engineers building complex, high‑throughput embedded systems. Its defined core voltage range and documented operating temperatures provide clear parameters for power and thermal design.

This device is suited for teams that need to consolidate multiple digital functions into a single programmable device while maintaining industrial robustness. Detailed device documentation is available for integration and system qualification.

Request a quote or submit an inquiry to receive pricing and availability information for the 5AGXMA3D4F27I5G Arria V GX FPGA.