5AGXMA3D4F27C5N

The 5AGXMA3D4F27C5N is an Intel Arria V GX Field Programmable Gate Array (FPGA) offered in a 672‑FBGA (27×27) FCBGA package. It delivers a high logic capacity and embedded on‑chip memory in a surface‑mount package designed for commercial‑grade applications.

Key attributes—including 156,000 logic elements, approximately 11.75 Mbits of embedded memory, and 336 I/O—make this device suitable for designs that require substantial logic density, on‑chip RAM, and broad I/O connectivity within a compact BGA footprint.

Key Features

• Core Logic  156,000 logic elements provide substantial resources for complex logic implementation and custom hardware acceleration.
• Embedded Memory  Approximately 11.75 Mbits of on‑chip RAM to support buffering, state storage, and memory‑intensive logic functions.
• I/O Capacity  336 programmable I/O pins for flexible interfacing to peripherals, memory, and system buses.
• Packaging  672‑BBGA FCBGA package (supplier package: 672‑FBGA, 27×27) in a surface‑mount form factor for compact PCB integration.
• Power  Core voltage supply specified at 1.07 V to 1.13 V to match system power design requirements.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for typical commercial embedded environments.
• Compliance  RoHS‑compliant manufacturing to meet environmental and assembly standards.

Typical Applications

• Logic‑dense FPGA designs  Use the device where a large number of logic elements are needed to implement complex, custom digital functions.
• Memory‑intensive processing  Leverage approximately 11.75 Mbits of embedded memory for buffering, packet processing, or large state machines.
• I/O‑rich systems  Deploy in systems that require hundreds of I/O signals to interface with sensors, peripherals, or external memory devices.
• Compact PCB implementations  The 672‑FBGA package supports high‑density board layouts and surface‑mount assembly for space‑constrained designs.

Unique Advantages

• High logic capacity: 156,000 logic elements enable implementation of complex digital functions without external logic expansion.
• Substantial on‑chip RAM: Approximately 11.75 Mbits of embedded memory reduces reliance on external memory for many applications.
• Extensive I/O: 336 I/O pins provide flexibility to support diverse peripheral and bus interfaces directly from the FPGA.
• Compact, manufacturable package: 672‑FBGA (27×27) FCBGA surface‑mount package simplifies PCB routing while supporting automated assembly.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C aligns with standard commercial electronic environments.
• RoHS compliant: Environmentally compliant manufacturing facilitates global assembly and distribution requirements.

Why Choose 5AGXMA3D4F27C5N?

The 5AGXMA3D4F27C5N Arria V GX FPGA balances high logic density, significant embedded memory, and broad I/O capability inside a compact 672‑FBGA surface‑mount package. It is positioned for commercial designs that require large programmable fabric and on‑chip RAM while maintaining a compact board footprint and standard temperature range.

Supported by Intel Arria V device documentation, this part is appropriate for teams seeking a verified FPGA device with clearly specified electrical, timing, and configuration characteristics for reliable integration into mid‑ to high‑complexity systems.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5AGXMA3D4F27C5N Arria V GX FPGA.