5AGXMA3D4F27C4N

The 5AGXMA3D4F27C4N is an Arria V GX Field Programmable Gate Array (FPGA) delivered in a 672-ball BGA package. It provides a high-density programmable logic fabric with substantial on-chip RAM and a large I/O count for demanding digital designs.

Designed for commercial-grade applications, this device combines 156,000 logic elements and approximately 11.7 Mbits of embedded memory with 336 user I/Os, making it suitable for systems that require significant logic capacity, memory resources, and board-level I/O density.

Key Features

• Programmable Logic Capacity  156,000 logic elements provide extensive resources for complex fabric implementations.
• Logic Array Blocks  7,362 logic array blocks (LABs) to organize logic efficiently for synthesis and place-and-route.
• Embedded Memory  Total on-chip RAM of 11,746,304 bits — approximately 11.7 Mbits of embedded memory for buffering, FIFOs, and local storage.
• I/O Density  336 user I/Os to support broad interfacing and parallel connectivity on modern PCBs.
• Package Options  672-BBGA, FCBGA package (supplier package: 672-FBGA, 27×27 mm) optimized for surface-mount assembly.
• Power Supply Range  Core voltage supply specified from 1.07 V to 1.13 V to match system power delivery requirements.
• Operating Temperature  Commercial operating range from 0 °C to 85 °C for standard temperature environment deployments.
• Mounting & Compliance  Surface-mount device construction with RoHS compliance for assembly and environmental requirements.

Typical Applications

• High-density digital processing  Use the device where large logic capacity and embedded memory are needed to implement custom datapaths, protocol handling, or control logic.
• Interface aggregation  Leverage 336 I/Os for aggregating multiple parallel or serial interfaces at the board level.
• Prototyping and system integration  Deploy as a programmable platform for validating ASIC-ready logic or integrating custom accelerators with significant on-chip resources.

Unique Advantages

• Substantial on-chip resources: 156,000 logic elements and approximately 11.7 Mbits of embedded memory reduce reliance on external logic and memory components.
• High I/O count: 336 user I/Os simplify board routing and support multiple peripheral connections without external expanders.
• Compact BGA packaging: 672-ball FCBGA (27×27) package balances high pin count with a compact footprint for space-constrained designs.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lifecycles.
• Controlled core voltage: Narrow supply window (1.07 V–1.13 V) supports predictable power design and regulator selection.

Why Choose 5AGXMA3D4F27C4N?

The 5AGXMA3D4F27C4N Arria V GX FPGA delivers a balanced combination of large programmable logic capacity, significant embedded memory, and a high I/O count in a compact 672-ball BGA package. Its commercial-grade specification and RoHS compliance make it a practical choice for production systems and designs that demand substantial on-chip resources without expanding board-level component count.

Engineers and procurement teams targeting scalable FPGA-based solutions will find this device suitable for applications that require dense logic fabrics, on-chip buffering, and broad interfacing — all with clear electrical and thermal parameters for system integration.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for 5AGXMA3D4F27C4N.