5AGXMA1D6F31C6G

The 5AGXMA1D6F31C6G is an Intel Arria V GX field programmable gate array supplied in a surface-mount 896-BBGA / 896-FBGA (31×31) package. It delivers a balance of on-chip logic and memory resources with 75,000 logic elements and approximately 8.67 Mbits of embedded memory for reconfigurable digital system designs.

With 416 general-purpose I/O pins, a core supply range of 1.07 V to 1.13 V, commercial-grade operating temperature (0 °C to 85 °C), and RoHS compliance, this device targets hardware designs that require substantial logic capacity, plentiful I/O, and a compact BGA package footprint.

Key Features

• Logic Capacity  75,000 logic elements provide substantial programmable logic resources for complex digital implementations.
• Embedded Memory  Approximately 8.67 Mbits of on-chip RAM supports large buffers, FIFOs, and embedded data structures without external memory for many use cases.
• I/O Density  416 I/O pins enable wide parallel interfaces and flexible board-level connectivity options.
• Package & Mounting  Packaged in an 896-BBGA (896-FBGA, 31×31) FCBGA format and designed for surface-mount assembly.
• Power  Core voltage supply specified between 1.07 V and 1.13 V for defined power planning and regulator selection.
• Operating Conditions  Commercial grade operation across 0 °C to 85 °C; RoHS compliant.

Typical Applications

• System Prototyping and FPGA-based Development  Use the device where large programmable logic capacity and significant embedded RAM accelerate hardware validation and algorithm development.
• High-Density I/O Interface Implementations  416 I/Os suit designs requiring multiple parallel interfaces, custom bus bridging, or extensive sensor/actuator connectivity.
• Embedded Logic and Control  Deploy as the central reconfigurable logic element in systems that need compact packaging and a high count of programmable resources.

Unique Advantages

• High programmable logic count: 75,000 logic elements provide headroom for complex state machines, parallel datapaths, and custom accelerators.
• Substantial on-chip memory: Approximately 8.67 Mbits of embedded RAM reduces dependence on external memory for many buffering and local-storage tasks.
• Extensive I/O availability: 416 I/O pins offer design flexibility for multiple interfaces and board-level integration without sacrificing GPIO bandwidth.
• Compact BGA package: 896-FBGA (31×31) package delivers a high-pin-count solution in a compact surface-mount form factor for dense PCB layouts.
• Defined power envelope: Narrow core voltage range (1.07 V–1.13 V) helps streamline power-supply design and voltage regulation choices.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronics applications.

Why Choose 5AGXMA1D6F31C6G?

The 5AGXMA1D6F31C6G Arria V GX FPGA combines a large pool of logic elements, meaningful embedded memory, and a high I/O count in a compact 896-BBGA package, making it suitable for designs that require substantial reconfigurable logic and dense connectivity in a commercial temperature range. Its clear electrical and package specifications simplify system-level integration and BOM planning.

This device is well suited for engineering teams building complex FPGA-based systems that need scalable logic resources, on-chip RAM capacity, and flexible I/O in a surface-mount BGA footprint. Intel’s Arria V GX packaging and specification set supports reliable deployment in a wide range of commercial embedded applications.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5AGXMA1D6F31C6G for your next design.