5AGXMA1D6F31C6N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 416 8666112 75000 896-BBGA, FCBGA |
|---|---|
| Quantity | 46 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 416 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3537 | Number of Logic Elements/Cells | 75000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8666112 |
Overview of 5AGXMA1D6F31C6N – Arria V GX Field Programmable Gate Array (FPGA) IC, 75,000 logic elements, ~8.666 Mbits RAM, 416 I/Os, 896-BBGA
The 5AGXMA1D6F31C6N is an Intel Arria V GX field programmable gate array (FPGA) in a commercial-grade offering. It delivers high-density programmable logic with integrated on-chip memory and a large number of I/O pins in a compact FCBGA package.
Typical design use cases include commercial digital systems that require substantial logic capacity, embedded memory, and extensive external interfacing while operating within standard commercial temperature and supply ranges.
Key Features
- Logic Capacity — 75,000 logic elements provide substantial programmable resources for complex digital functions.
- Embedded Memory — Total on-chip RAM capacity of 8,666,112 bits (approximately 8.666 Mbits) for FIFOs, buffering, and on-chip data storage.
- I/O Density — 416 I/O pins to support broad connectivity and high pin-count interfaces.
- Power and Core Supply — Core voltage supply specified from 1.07 V to 1.13 V for predictable power planning and margining.
- Package and Mounting — Surface-mount 896-BBGA (FCBGA) package with supplier device package listed as 896-FBGA (31×31) for compact board-level integration.
- Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High logic density: 75,000 logic elements enable implementation of complex logic functions and sizable custom hardware accelerators.
- Substantial on-chip memory: Approximately 8.666 Mbits of embedded RAM reduces dependence on external memory for mid-sized buffering and state storage.
- Extensive external interfacing: 416 I/Os accommodate multiple parallel interfaces, buses, and peripheral connections on a single device.
- Compact, surface-mount package: The 896-BBGA (31×31) FCBGA package delivers high pin count in a space-efficient footprint for dense board designs.
- Narrow core voltage window: 1.07–1.13 V supply range simplifies power-rail design and validation for the core domain.
- Commercial temperature rating: 0 °C to 85 °C supports standard commercial deployments and environments.
Why Choose 5AGXMA1D6F31C6N?
This Arria V GX device is positioned for commercial designs that require a balance of high logic density, on-chip memory, and broad I/O capability in a compact FCBGA package. Its defined core voltage window and commercial temperature grade make it suitable for production systems that follow standard commercial specifications.
Engineers selecting 5AGXMA1D6F31C6N gain a programmable logic device backed by Intel’s Arria V family documentation and electrical specifications, enabling predictable integration into mid- to high-density FPGA designs where on-chip memory and plentiful I/O are priorities.
Request a quote or submit your RFQ to obtain pricing and availability for the 5AGXMA1D6F31C6N.

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