5AGXMA3D4F27C5G

The 5AGXMA3D4F27C5G is an Intel Arria V GX Field Programmable Gate Array (FPGA) IC designed for commercial applications that require substantial on‑chip logic, embedded memory, and a high count of user I/O. This device integrates 156,000 logic elements and approximately 11.7 Mbits of embedded memory in a 672‑FBGA (27×27) surface‑mount package.

Targeted at commercial equipment, the device operates from a core supply voltage of 1.07 V to 1.13 V and is specified for an ambient temperature range of 0 °C to 85 °C. The package and I/O density support compact, board‑level implementations where logic capacity and memory are key design drivers.

Key Features

• Core Logic 156,000 logic elements to implement complex digital logic and custom accelerators.
• On‑chip Memory Approximately 11.7 Mbits of embedded RAM (Total Ram Bits: 11,746,304) for buffering, state storage, and on‑chip data structures.
• I/O Capacity 336 user I/O pins to support high pin‑count interfaces and flexible board connections.
• Power and Operating Conditions Core supply voltage range of 1.07 V to 1.13 V; commercial operating temperature range of 0 °C to 85 °C.
• Package & Mounting 672‑BBGA, FCBGA package case; supplier device package listed as 672‑FBGA (27×27); surface‑mount mounting type for standard PCB assembly.
• Grade & Compliance Commercial grade device; RoHS compliant.

Typical Applications

• Commercial embedded systems: On‑board logic and memory capacity for control, protocol handling, and integration in commercial equipment operating within 0 °C to 85 °C.
• Prototyping and evaluation platforms: High logic element count and substantial embedded RAM enable complex prototypes and proof‑of‑concept designs.
• High‑density I/O modules: 336 I/O pins and a compact 672‑FBGA package support dense interface routing on space‑constrained PCBs.

Unique Advantages

• High logic density: 156,000 logic elements provide the capacity for large combinational and sequential designs.
• Significant embedded memory: Approximately 11.7 Mbits of on‑chip RAM reduces external memory dependence for many designs.
• Generous I/O count: 336 user I/O enable flexible system integration and multiple peripheral interfaces.
• Compact BGA footprint: 672‑FBGA (27×27) surface‑mount package supports compact PCB layouts and conventional assembly processes.
• Commercial operating specification: Rated for 0 °C to 85 °C, matching typical commercial deployment conditions.
• RoHS compliant: Meets standard environmental compliance requirements for commercial electronics.

Why Choose 5AGXMA3D4F27C5G?

The 5AGXMA3D4F27C5G Arria V GX FPGA delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact surface‑mount FBGA package. Its commercial temperature rating and defined core voltage range make it suitable for a wide range of board‑level designs where on‑chip resources reduce external component count and simplify system architecture.

Designers and procurement teams seeking a commercial‑grade FPGA with defined electrical and thermal limits will find this device appropriate for projects that require substantial on‑chip resources and compact packaging.

Request a quote or submit an inquiry to receive pricing and availability for the 5AGXMA3D4F27C5G Arria V GX FPGA.