5AGXMA3D4F27I3G

The 5AGXMA3D4F27I3G is an Intel Arria V GX field-programmable gate array (FPGA) in a 672‑BBGA, FCBGA package designed for industrial-grade embedded systems. It integrates 156,000 logic elements and 7,362 CLBs with approximately 11.7 Mbits of on-chip RAM and provides 336 user I/O pins for complex system interfacing.

Key hardware characteristics include surface-mount packaging (672‑FBGA, 27×27), a core supply range of 1.12 V to 1.18 V, RoHS compliance, and an operating temperature range of –40 °C to 100 °C. Detailed electrical, switching, configuration, and I/O timing specifications are documented in the device datasheet.

Key Features

• Core Logic Density  Offers 156,000 logic elements and 7,362 CLBs to implement wide-ranging programmable logic and control functions.
• Embedded Memory  Approximately 11.7 Mbits of on-chip RAM to support buffering, packet processing, and on-chip data storage.
• I/O Capability  336 I/O pins available for flexible interfacing with external peripherals, mezzanine modules, and board-level signals.
• Industrial Temperature Rating  Rated for operation from –40 °C to 100 °C, suitable for industrial-environment deployments.
• Power Supply  Core voltage operation specified between 1.12 V and 1.18 V for predictable power budgeting and core rail design.
• Package & Mounting  Surface-mount 672‑BBGA (supplier package: 672‑FBGA, 27×27) for compact, board-level integration.
• Standards & Compliance  RoHS compliant.
• Comprehensive Documentation  Arria V device datasheet provides electrical characteristics, switching characteristics, configuration timing, and I/O timing information to support design and validation.

Unique Advantages

• High logic capacity: 156,000 logic elements enable implementation of complex control, signal-processing, and custom-acceleration functions without immediate external logic.
• Substantial on-chip memory: Approximately 11.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage tasks.
• Robust I/O count: 336 I/Os allow broad peripheral connectivity and multi-channel interfacing in a single device.
• Industrial-ready thermal range: –40 °C to 100 °C rating supports deployment in a wide range of industrial ambient conditions.
• Compact BGAs for dense boards: The 672‑FBGA (27×27) package enables high-density PCB layouts while maintaining a large programmable fabric.
• Design verification support: The available datasheet covers electrical, switching, configuration, and I/O timing details necessary for rigorous system validation.

Why Choose 5AGXMA3D4F27I3G?

The 5AGXMA3D4F27I3G Arria V GX FPGA combines substantial programmable logic, embedded memory, and a high I/O count in an industrial-grade BGA package, offering a balanced platform for demanding embedded and industrial applications. Its documented electrical and configuration specifications support predictable integration and system-level validation.

This device is well suited to designs that require a large programmable fabric, significant on-chip RAM, and robust I/O, while operating across industrial temperature ranges. The comprehensive device documentation supports reliable prototype-to-production workflows.

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