5AGXMA3D4F27I3

The 5AGXMA3D4F27I3 is an Intel Arria V GX field-programmable gate array supplied in a 672-ball BGA (FCBGA) package. It integrates high-density programmable logic, a substantial pool of embedded RAM, and a broad I/O complement to support complex digital designs.

Targeted for industrial applications, this device combines 156,000 logic elements with approximately 11.75 Mbits of on-chip RAM and 336 I/Os, delivering a platform for custom logic integration, data buffering, and multi-interface aggregation within a compact surface-mount package.

Key Features

• Core Logic  156,000 logic elements for implementing large-scale digital designs and custom processing blocks.
• Embedded Memory  Approximately 11.75 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic functions.
• I/O and Periphery  336 user I/Os to accommodate a wide range of peripheral interfaces and signal connectivity.
• Power and Voltage  Core voltage supply range of 1.12 V to 1.18 V to match system power-rail planning for the FPGA core.
• Package and Mounting  672-ball BGA (672-FBGA, 27 × 27 mm) FCBGA package designed for surface-mount applications, offering a compact high-pin-count solution.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial control and automation  Use the device’s industrial operating range and extensive I/O to implement custom control logic, sensor interfacing, and system coordination functions.
• High-density logic integration  Leverage 156,000 logic elements to consolidate multiple digital functions into a single programmable device for reduced system complexity.
• Data buffering and packet processing  Approximately 11.75 Mbits of embedded RAM enable on-chip buffering, packet queues, and temporary data storage for streaming or bursty workloads.
• Multi-interface aggregation  336 I/Os support aggregation of diverse peripheral signals and interface routing in compact, board-level designs.

Unique Advantages

• High logic density: 156,000 logic elements allow designers to implement substantial custom hardware without partitioning across multiple devices.
• Significant on-chip memory: Approximately 11.75 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage needs.
• Large I/O count: 336 I/Os simplify board-level routing for systems that require many external connections or parallel interfaces.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in environments with wide thermal variation.
• Compact, high-pin-count package: 672-ball FCBGA (27 × 27 mm) enables dense designs while keeping a small PCB footprint.
• RoHS compliant: Aligns with environmental and materials requirements for many production programs.

Why Choose 5AGXMA3D4F27I3?

The 5AGXMA3D4F27I3 Arria V GX FPGA delivers a balanced combination of logic capacity, embedded memory, and I/O density in a surface-mount 672-ball FCBGA package. Its industrial temperature rating and defined core voltage range make it suitable for robust embedded and industrial systems that require deterministic programmable logic and on-chip buffering.

This device suits development teams and product designers who need to consolidate multiple digital functions into a single programmable device while preserving board space and supporting a large number of external interfaces. The Arria V family datasheet provides the detailed electrical and configuration specifications necessary for integration and system-level planning.

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