5AGXMA3D4F27C4G

The 5AGXMA3D4F27C4G is an Arria V GX field-programmable gate array (FPGA) IC supplied in a 672-pin FCBGA package. It delivers a high density of programmable logic with substantial embedded RAM and a large I/O count for complex digital designs.

Designed for commercial-grade applications, this device targets designs that require extensive on-chip logic, significant embedded memory, and a high number of external I/Os, while operating within a 1.07–1.13 V core supply window and a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 156,000 logic elements for implementing complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 11.7 Mbits of on-chip RAM (11,746,304 total RAM bits) to support data buffering, FIFOs, and memory-intensive designs.
• I/O Density — 336 user I/Os to interface with a wide range of peripherals and external devices.
• Package & Mounting — 672-pin FCBGA (672-FBGA, 27×27) surface-mount package to support high pin-count board designs and compact system integration.
• Power Domain — Core voltage operation in a defined range of 1.07 V to 1.13 V for predictable power planning and supply design.
• Operating Grade & Temperature — Commercial-grade device specified for 0 °C to 85 °C operating temperature.
• Standards Compliance — RoHS-compliant construction.
• Documentation — Supported by an Arria V device datasheet covering electrical characteristics, switching characteristics, configuration specifications, and I/O timing.

Typical Applications

• Custom Digital Systems — Dense logic capacity and embedded RAM enable implementation of tailored datapaths and control logic for bespoke digital designs.
• Interface and I/O Expansion — High I/O count supports bridging, protocol translation, and aggregation of multiple peripheral interfaces.
• Memory-Intensive Logic — On-chip RAM is suited for buffering, packet queues, or other localized data storage needs within FPGA-based systems.
• Prototyping and System Integration — Surface-mount 672-FBGA package facilitates integration into compact PCBs for validation and system prototypes.

Unique Advantages

• High logic density: 156,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level component count.
• Significant embedded memory: Approximately 11.7 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks.
• Large I/O complement: 336 I/Os enable direct connections to numerous peripherals and high-pin-count interfaces without additional expander logic.
• Compact high-pin package: The 672-FBGA (27×27) surface-mount package offers a balance of pin density and board-area efficiency for integrated designs.
• Predictable power envelope: Narrow core voltage range (1.07–1.13 V) simplifies core power supply design and system power budgeting.
• Commercial readiness: Specified operating range of 0 °C to 85 °C and RoHS compliance support deployment in commercial-grade applications.

Why Choose 5AGXMA3D4F27C4G?

The 5AGXMA3D4F27C4G Arria V GX FPGA combines high programmable logic capacity, meaningful on-chip RAM, and a large I/O count in a 672-pin FCBGA package, offering a compact yet capable platform for commercial embedded and system designs. Its clearly defined electrical and thermal specifications make it suitable for designs that require reliable, high-density programmable logic with predictable power and thermal characteristics.

Engineers building memory-intensive, I/O-rich, or high-integration digital systems will find this device suited for consolidating multiple functions while retaining the flexibility of FPGA-based implementations. Detailed device documentation covers electrical characteristics, switching behavior, configuration, and I/O timing to aid design and validation.

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