5AGXMA3D4F27I5N

The 5AGXMA3D4F27I5N is an Arria V GX FPGA in an industrial-grade offering. This device provides a high-density programmable fabric with 156,000 logic elements and approximately 11.7 Mbits of embedded RAM, suitable for complex digital designs that require substantial on-chip resources and flexible I/O.

Packaged in a 672-ball FCBGA (27 × 27) and rated for surface-mount assembly, the device is specified for operation from -40°C to 100°C with a core supply range of 1.07 V to 1.13 V, enabling use in industrial temperature environments and high-density system integrations.

Key Features

• Core Logic 156,000 logic elements provide a large programmable fabric for complex designs and system-level integration.
• Embedded Memory Approximately 11.7 Mbits of total on-chip RAM for frame buffers, FIFOs, and memory-intensive logic functions.
• I/O Capacity 336 dedicated I/O pins to support multiple interfaces, high pin-count peripherals, and board-level interconnects.
• Package and Mounting 672-BBGA (FCBGA) package, supplier device package: 672-FBGA (27 × 27). Surface-mount mounting for compact board-level integration.
• Industrial Grade and Temperature Range Device is graded as Industrial and specified for operation from -40 °C to 100 °C, supporting temperature-sensitive deployments.
• Core Voltage Specification Tight core voltage range between 1.07 V and 1.13 V for predictable power-supply design and regulation.
• Standards and Compliance RoHS compliant to meet environmental and regulatory requirements for lead-free manufacturing.

Typical Applications

• Industrial Control Systems Industrial-grade temperature rating and robust logic capacity make this FPGA suitable for control, automation, and monitoring applications.
• High-Density I/O Systems 336 I/O pins enable complex interface bridging, multi-protocol connectivity, and large peripheral arrays on a single device.
• Memory-Intensive FPGA Functions Approximately 11.7 Mbits of on-chip RAM supports buffering, packet processing, and other data-path functions that require embedded memory.

Unique Advantages

• High Logic Capacity: 156,000 logic elements offer the headroom to implement complex algorithms and system integration on a single FPGA.
• Significant Embedded Memory: Approximately 11.7 Mbits of RAM reduces external memory dependency for many designs, simplifying board layout and BOM.
• Large I/O Count: 336 I/Os allow flexible connectivity options and support for multiple simultaneous interfaces without external expanders.
• Industrial Temperature Rating: Specified operation from -40 °C to 100 °C supports deployment in harsh and temperature-variable environments.
• Compact FCBGA Footprint: 672-ball FCBGA (27 × 27) provides a compact high-density package suitable for space-constrained system boards.
• Regulatory Compliance: RoHS compliance facilitates lead-free manufacturing and meets common environmental procurement requirements.

Why Choose 5AGXMA3D4F27I5N?

The 5AGXMA3D4F27I5N brings substantial programmable resources, embedded memory, and a high I/O count in an industrial-grade Arria V GX device. Its defined core-voltage window and wide operating temperature range make it a predictable choice for designs that require reliable operation across demanding environmental conditions.

This part is well suited for engineering teams aiming to consolidate functionality into a single FPGA—minimizing external components while retaining flexibility to implement complex logic, memory buffering, and multiple interface endpoints.

If you need pricing, availability, or a formal quote for the 5AGXMA3D4F27I5N, request a quote or submit an RFQ to obtain the information required for procurement and design planning.